LP38501TSX-ADJ, 200,000 brands of TI 21+ original stock, please contact Mr. Tan 17688152295 for price consultation

LP38501TSX-ADJ parameters:

2.7V to 5.5V Input for 3A FlexCap Low Dropout Linear Regulator

[3A FlexCap Low Dropout Linear Regulator for 2.7V to 5.5V Inputs]

should be separated from the clean circuit where possible, and

Ground through a separate path. At MHz frequencies,

ground planes start looking inductive and RFI/EMI will cause

bounces across the ground plane. in a multi-layer PC

board applications should be carefully laid out so that

Noisy power and ground planes do not radiate directly to

Carry analog power and ground planes adjacent.

output noise

Noise is two ways- stipulated

point noise

or

Output noise density

is the sum of all RMS

noise source, measured at the regulator output, at a specific

frequency (measured in 1Hz bandwidth). this kind

Noise is usually plotted as a function of frequency.

Total output noise voltage

or

broadband noise

is RMS

The sum of the point noise exceeds the specified bandwidth, usually several

frequency over the decades. Units to watch out for

Measurement.

Point noise is measured in μV/

√

Hz or Nevada/

√

Hertz and Total

The unit of output noise is μV (rms). main source of

The noise in the low dropout regulator is internally referenced. exist

CMOS regulator, noise has low frequency content and

high frequency components and thus largely depends on

silicon area and quiescent current.

Noise can generally be reduced in two ways: increase

transistor area or increase the reference current. but,

Enlarging transisitors will increase die size and increase

Reference current means higher total supply current

(ground pin current).

Short circuit protection

The LP38501/3-ADJ contains an internal current limit which

will reduce the output current to a safe value, if the output is over

load or short circuit. According to the value of V

IN

,hot

Limiting also has the potential to become active average power dissipation

pated to increase the mold temperature to the limit value

(about 170°C). Thermal shutdown CIR's lag

cuitry can result in "looping" behavior as the chip's output

temperature when heating and cooling.

Operation enabled (LP38501-ADJ only)

The enable pin (EN) must be actively terminated either

10 kΩ pull-up resistor to V

IN

or a drive which actively pulls

high and low (eg CMOS rail-to-rail comparator). if active

When in use, the driver's pull-up resistor is not required. This pin must

Connect to V

IN

if not used (it cannot be left floating).

Input and output voltage difference

The voltage difference of a regulator is defined as the input for-

The differential output required by the regulator to maintain the output

voltage at 2% of rated value. Different for CMOS LDO,

The product of the load current sum of the voltage difference

R

DS (ON)

of the internal MOSFET pass element.

Since the output voltage begins to "fall out" of the regulation

When it drops by 2% and ash, the electrical performance of the device

compared to the values listed in the electrical will be reduced

Some parameters of the characteristic table (linear and load regulation

unwillingness to have PSRR suffer).

reverse current path

The LP38501/3-ADJ internal MOSFET pass element

has inherent parasitic diodes. During normal operation, the

Input voltage is higher than output voltage and higher alignment

SITIC diodes are reverse biased. However, if the output is pulled

input in the application above, the current flows from

The parasitic diode from the output to the input is forward biased.

The output can work with the input above as long as the current is pulled

Rent of parasitic diodes is limited to 200 ??mA continuous and

1A peak. The regulator output pins should not take the following

ground potential. If LP38501/3 - adjectives are used in dual support

where the regulator load is returned to a negative ply system

To power, the output must be diode clamped to ground.

Power consumption/cooling

Maximum power dissipation (P

D (max)

) LP38501/3-

ADJ is limited by the maximum junction temperature

125°C, along with the maximum ambient temperature (T

A

(maximum)

) application, and thermal resistance (θ

JA

)of

the package. Under all possible conditions, the junction temperature

perature (T

J

) must be in the range specified by the operands in

Ating rating. The total power consumption of the device is

is given by:

P

D

= ( (V

IN

? V

OUT

) ×1

OUT

) + (V

IN

X me

GND

)

(1)

there i

GND

is the operating ground current of the device

(specified in Electrical Characteristics).

Maximum allowable junction temperature rise (ΔT

J

) deicer

Hold temporarily at maximum expected ambient temperature

(T

A (maximum value)

) application, and the maximum allowed junc-

temperature (T

J (lower max)

):

ΔT

J

= T

J (lower max)

?T

A (maximum value)

(2)

1-93 maximum allowable value for node to environment

episodic,

θ

JA

, which can be calculated using the following formula:

θ

JA

= ΔT

J

/P

D (max)

(3)

The LP38501/3-ADJ is available in the TO-263 package. Should

Thermal resistance depends on the amount of copper area

assigned to the heat transfer.

Thermal TO-263, TO-263 Thin Package

Available in TO-263 package and TO-263 thin package

The copper layer on the PCB board acts as a heat sink. The packaged DAP

Age soldered on copper layer to dissipate heat.

sci-fi gure

12

shows a typical curve as

θ

JA

in TO-263 package of

For different copper area sizes (thermal performance

Both TO-263 and TO-263 films are the same). test

Also, use only 1 oz copper on the top side of a PCB

This is square.