CDC3S04YFFR Other IC_CC2640R2FRSMR Other Passive Components Guide

With crystal oscillation, precise rhythm is achieved. But when these expensive crystals wear out, they can vibrate or jump, affecting the accuracy of timekeeping.

The company currently has two 300mm fabs named RFAB and DMO56. TI outsources much of its logic and embedded IC production to foundries, but mostly produces analog chips in its own factories.

CDC3S04YFFR Other IC_CC2640R2FRSMR Other passive components

TLC2272CDR op amp IC

TPS65131TRGERQ1 TPS73701DCQR TPS2421-2DDAR TPS61022RWUR TPS61041DBVR.

TPS61230ARNSR TPS613221ADBVR TPS613221ADBVT LM321LVIDBVR TPS562201DDCR.

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

TMP112AIDRLR TS3A225ERTER TPS2546RTER TMP112AIDRLT TPS82130SILR.

CDC3S04YFFR Other IC_CC2640R2FRSMR Other passive components

TPS65150RGER

. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave.

When asked why nobody in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop. But it's not easy to convert electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock." TI has been involved in MEMS research for many years.

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

TPS65400RGZR TPS65400RGZT TPS92515QDGQRQ1 TPS92515QDGQTQ1 TPS560430XFDBVT.

CDC3S04YFFR Other IC_CC2640R2FRSMR Other passive components

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and finally the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

relevant information