OPA2365AIDR_DE1E3KX332MB4BN01F Introduction

. With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab.

Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total. The details are shown in the figure below. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs. .

OPA2365AIDR_DE1E3KX332MB4BN01F

SN65DSI86ZQER Interface IC

Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say.

"Quartz crystals require additional components to extend their accuracy -- over time -- as their performance changes beyond controllable temperature changes," he added. In addition, Solis said, "using a BAW resonator is more efficient than using a quartz crystal. precise.

TPS563209DDCR TPS563209DDCT TS3USB221RSER LM339APWR MAX3232IPWR.

TMP112AIDRLR TS3A225ERTER TPS2546RTER TMP112AIDRLT TPS82130SILR.

OPA2365AIDR_DE1E3KX332MB4BN01F

DE2E3KY222MB2BM01F

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

BQ24311DSGR TIC10024QDCPRQ1 TL331IDBVR TL331IDBVT TPS63070RNMT.

OPA2365AIDR_DE1E3KX332MB4BN01F

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and finally the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

The BAW filter is more suitable for frequencies above 2.5GHz. The manufacturing process of the BAW filter is also very consistent with the existing IC manufacturing process, and is suitable for overall integration with other active circuits. .

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