TPS54550PWPR_UCC2803DTR Industrial Control Components Guide

Texas Instruments currently has 15 wafer fabs in 9 countries, of course, these plants include outdated capacity that is about to close, as well as new 300mm capacity. In April 2019, Diodes completed the acquisition of Texas Instruments' 150mm/200mm wafer fab (GFAB) in Greenock, Scotland, UK, as part of TI's strategy to gradually abandon outdated capacity.

From a regional perspective, Japan closed the largest number of fabs. It is reported that Renesas expects to close two more 150mm fabs in 2020 or 2021. Take Renesas as an example. The company's two recently closed fabs are both 150mm, including a fab in Kochi Prefecture, Japan, which produces analog, logic devices and some obsolete micro components. In addition, Renesas has adjusted its factory in Otsu, Shiga Prefecture, Japan, to manufacture optoelectronic devices.

TPS54550PWPR_UCC2803DTR Industrial Control Components

LM4040AIM3X-5.0/NOPB

TPS74801DRCR TPS22918DBVR TLV62569ADRLR TLV62569ADRLT TPS61230ARNST.

DAC7311IDCKR TPS62260DDCR TPS62260DDCT TPS62261TDRVRQ1 TCA9544APWR.

Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say.

TMP112AIDRLR TS3A225ERTER TPS2546RTER TMP112AIDRLT TPS82130SILR.

TPS54550PWPR_UCC2803DTR Industrial Control Components

TPS62040DRCR Power Module

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

TPS60403DBVR CSD17313Q2 TPS259571DSGR TPS259571DSGT TLV3202AQDGKRQ1.

"The new BAW resonator technology is important because TI is integrating it into its silicon products, reducing design time, solution size and component cost," said Philip Solis, research director for connectivity and smartphone semiconductors at IDC.

TPS54550PWPR_UCC2803DTR Industrial Control Components

The typical basic structure is shown in the figure (a) above, with the piezoelectric layer sandwiched between the upper and lower metal electrodes, the corresponding mBVD equivalent circuit is shown in the figure (b) above, and the corresponding impedance is shown in the figure (c) above. It can be seen that there are two resonance frequencies, series (fs) and parallel (fp). The working principle is as shown below.

??Membrane Type is etched from the back of the substrate to the surface (that is, the bottom electrode surface) to form a suspended thin film and a cavity. ?? There is also a method called FBAR (Film Bulk Acoustic Resonator), including Membrane type and Airgap type. .

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