ISO7720DR Protection IC_TPS5450DDAR Power IC Guide

TI has been steadily ramping up its production of analog chips on 300mm wafers in recent years to cut costs and increase productivity. TI said the 300mm fab yields 40% cheaper chips than the 200mm process used by competitors. Also, for analog use, the ROI of a 300mm fab is likely to be higher because it can last 20 to 30 years.

Texas Instruments currently has 15 wafer fabs in 9 countries, of course, these plants include outdated capacity that is about to close, as well as new 300mm capacity. In April 2019, Diodes completed the acquisition of Texas Instruments' 150mm/200mm wafer fab (GFAB) in Greenock, Scotland, UK, as part of TI's strategy to gradually abandon outdated capacity.

ISO7720DR Protection IC_TPS5450DDAR Power IC

EL5411IREZ-T13

TPS74801DRCR TPS22918DBVR TLV62569ADRLR TLV62569ADRLT TPS61230ARNST.

For the first time in the industry, TI uses this technology for integrated clock functions. • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones. In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: .

The basic structure of the BAW filter is that two metal electrodes sandwich a piezoelectric film (the thickness of the Quartz substrate is 2um at 2GHz), and the acoustic wave oscillates in the piezoelectric film to form a standing wave.

A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production. So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers.

ISO7720DR Protection IC_TPS5450DDAR Power IC

TPS61256YFFR Power IC

LM5176PWPR LM5176PWPT DRV8876PWPR TPS23751PWPR TPS61194PWPR.

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

TPS60403DBVR CSD17313Q2 TPS259571DSGR TPS259571DSGT TLV3202AQDGKRQ1.

ISO7720DR Protection IC_TPS5450DDAR Power IC

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

However, the thin film structure needs to be strong enough to be unaffected by subsequent processes. Compared with BAW-SMR, a smaller part of the membrane type is in contact with the underlying substrate, which is not easy to dissipate heat.

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