TPS2065CDBVR-2 Power IC_GRM2165C2A151JA01D Introduction

The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018. In the analog chip market, manufacturers such as TI, ADI, and Maxim all have gross profit margins higher than the industry average. According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs.

TI outsources much of its logic and embedded IC production to foundries, but mostly produces analog chips in its own factories. The company currently has two 300mm fabs named RFAB and DMO56.

TPS2065CDBVR-2 Power IC_GRM2165C2A151JA01D

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This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say.

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

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TPS2065CDBVR-2 Power IC_GRM2165C2A151JA01D

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(Global TMT July 13, 2021) Texas Instruments (TI) has launched a new line of high-performance microcontrollers (MCUs) that advance real-time control, network connectivity and intelligent analytics at the edge. With the new Sitara AM2x family of MCUs, engineers can use 10 times the computing power of previous flash-based MCUs. The high-performance AM2x family closes the growing performance gap between MCUs and processors, enabling designers to push performance limits in applications such as factory automation, robotics, automotive systems, and sustainable energy management.

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TPS2065CDBVR-2 Power IC_GRM2165C2A151JA01D

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention. In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure.

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