BMA253 Speed Sensor_GRM2165C2A102JA01D Introduction

TI has been steadily ramping up its production of analog chips on 300mm wafers in recent years to cut costs and increase productivity. TI said the 300mm fab yields 40% cheaper chips than the 200mm process used by competitors. Also, for analog use, the ROI of a 300mm fab is likely to be higher because it can last 20 to 30 years.

With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab. .

BMA253 Speed Sensor_GRM2165C2A102JA01D

TPS2549RTER SMD Diode

DAC7311IDCKR TPS62260DDCR TPS62260DDCT TPS62261TDRVRQ1 TCA9544APWR.

A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production. So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers.

TPS65131TRGERQ1 TPS73701DCQR TPS2421-2DDAR TPS61022RWUR TPS61041DBVR.

TPS22919DCKR CSD23381F4 CSD23280F3 LM76002RNPR LM76002RNPT.

BMA253 Speed Sensor_GRM2165C2A102JA01D

GJM1555C1H120FB01D

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

When asked why no one in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop." TI has been involved in MEMS for years. However, converting electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

In short, advances in BAW technology have brought "higher performance, simpler design, lower cost and smaller size" to wired and wireless networks, Wong explained.

BMA253 Speed Sensor_GRM2165C2A102JA01D

Wireless networking is at the heart of this data migration, and the ability to connect the last mile through connected devices is a critical part of the data loop. "By leveraging and analyzing large numbers of Making accurate, informed decisions with data is a very important innovation capability.

Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package.

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