SN75176BDR Power IC_GCJ188R71C334KA01D Introduction

In April 2019, Texas Instruments released the construction plan for this 300mm fab, with an estimated investment of $3.1 billion. However, in view of the sluggish semiconductor market in 2019 and the unsatisfactory revenue situation, TI's plan to invest in the construction of a 300mm wafer fab in Richardson is not as smooth as originally expected, and it may be delayed for two years to complete.

TI has been steadily ramping up its production of analog chips on 300mm wafers in recent years to cut costs and increase productivity. TI said the 300mm fab yields 40% cheaper chips than the 200mm process used by competitors. Also, for analog use, the ROI of a 300mm fab is likely to be higher because it can last 20 to 30 years.

SN75176BDR Power IC_GCJ188R71C334KA01D

LM5069MM-2/NOPB Power IC

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

SN74HCS74QPWRQ1 BQ27200EVM TPD8F003DQDR LMC6082AIN/NOPB.

TPS65131TRGERQ1 TPS73701DCQR TPS2421-2DDAR TPS61022RWUR TPS61041DBVR.

TPS61230ARNSR TPS613221ADBVR TPS613221ADBVT LM321LVIDBVR TPS562201DDCR.

SN75176BDR Power IC_GCJ188R71C334KA01D

TPS73201DCQR Other passive components

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

In short, advances in BAW technology have brought "higher performance, simpler design, lower cost and smaller size" to wired and wireless networks, Wong explained.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

SN75176BDR Power IC_GCJ188R71C334KA01D

The Membrane type is similar to the basic model of the BAW resonator, with air on both sides. Since the acoustic impedance of the air is much lower than that of the piezoelectric layer, most of the acoustic waves will be reflected back.

Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package.

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