LP5912-3.3DRVR_CSD87330Q3D Introduction

Texas Instruments announced its third-quarter earnings forecast on the 21st, with sales of $4.4 billion to $4.76 billion and profit of $1.87 to $2.13 per share in the third quarter ending in September. Analysts on average expected a profit of $1.97 a share on sales of $4.59 billion, according to data compiled by Bloomberg.

. Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total. The details are shown in the figure below. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs.

LP5912-3.3DRVR_CSD87330Q3D

EP3C80F780I7N Other passive components

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

In typical applications, AM243x devices can achieve this level of performance while consuming less than 1W of active power, enabling factory operators to extend power supply life and reduce operating costs and energy consumption. The additional processing power enables designers to further analyze features such as predictive maintenance, reducing downtime on the factory floor. .

Some automakers have opted to cancel certain features in response to chip shortages, while others are producing cars that lack the necessary chips and then storing them temporarily until they can be assembled at a later date. .

"The semiconductor crisis will drag on until 2022 because I don't see enough signs that additional production from Asian sourcing points will reach the West anytime soon," he was quoted by Reuters as speaking at an event. The views of the major German car companies are the same. The global chip shortage situation in many industries has not yet completely improved. Tang Weishi, executive officer of Stellantis, the world's fourth largest automaker, said on the 21st that the global chip shortage affecting the automotive industry is likely to continue until next year. .

LP5912-3.3DRVR_CSD87330Q3D

BQ27541DRZR-G1 Other passive components

TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

TPS65400RGZR TPS65400RGZT TPS92515QDGQRQ1 TPS92515QDGQTQ1 TPS560430XFDBVT.

TPS54310PWPR TPA3116D2DADR LM3429MHX/NOPB DP83867CRRGZT TPS62172DSGR.

TPS630701RNMT TPS630702RNMR TPS54218RTER TPS92692PWPR TPS56C230RJER.

LP5912-3.3DRVR_CSD87330Q3D

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

??Membrane Type is etched from the back of the substrate to the surface (that is, the bottom electrode surface) to form a suspended thin film and a cavity. ?? There is also a method called FBAR (Film Bulk Acoustic Resonator), including Membrane type and Airgap type. .

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