TPS7A6050QKVURQ1_SN74LVC1G3157DBVR Introduction

Texas Instruments currently has 15 wafer fabs in 9 countries, of course, these plants include outdated capacity that is about to close, as well as new 300mm capacity. In April 2019, Diodes completed the acquisition of Texas Instruments' 150mm/200mm wafer fab (GFAB) in Greenock, Scotland, UK, as part of TI's strategy to gradually abandon outdated capacity.

Low-Power MCUs with Processor-Level Performance AM243x MCUs are the first AM2x series devices available, featuring up to four Arm Cortex-R5F cores, each running at up to 800MHz. This high real-time processing speed is critical in factory equipment such as robots, where fast computing power combined with high-speed access to the MCU's internal memory can simultaneously help improve the robot's motion accuracy and speed, thereby increasing productivity. .

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In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: . For the first time in the industry, TI uses this technology for integrated clock functions. • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones.

Some automakers have opted to cancel certain features in response to chip shortages, while others are producing cars that lack the necessary chips and then storing them temporarily until they can be assembled at a later date. .

"The semiconductor crisis will drag on until 2022 because I don't see enough signs that additional production from Asian sourcing points will reach the West anytime soon," he was quoted by Reuters as speaking at an event. The views of the major German car companies are the same. The global chip shortage situation in many industries has not yet completely improved. Tang Weishi, executive officer of Stellantis, the world's fourth largest automaker, said on the 21st that the global chip shortage affecting the automotive industry is likely to continue until next year. .

TPS7A6050QKVURQ1_SN74LVC1G3157DBVR

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The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

"TI has been involved in MEMS for years. However, converting electrical energy to mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy. When asked why no one in the industry has built something like a BAW resonator , Upton said, "It's very difficult to develop.

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TPS7A6050QKVURQ1_SN74LVC1G3157DBVR

Wireless networks are at the heart of this data migration, and the ability to connect the last mile through connected devices is a key part of the data loop. "Making accurate, informed decisions through the use and analysis of large amounts of data is a very important innovation capability," said Ray Upton, vice president of TI's Interconnect Microcontroller Group.

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

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