ISO7720DR Protection IC_TPS5450DDAR Power IC Guide

. Some automakers have opted to cancel certain features in response to chip shortages, while others are producing cars that lack the necessary chips and then storing them temporarily until they can be assembled at a later date.

According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs. . Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total. The details are shown in the figure below.

ISO7720DR Protection IC_TPS5450DDAR Power IC

TCA9545APWR Analog IC

TPS74801DRCR TPS22918DBVR TLV62569ADRLR TLV62569ADRLT TPS61230ARNST.

. Lithography machine manufacturer ASML announced its second-quarter 2021 financial report on the 21st. The company's second-quarter revenue was 4.02 billion euros (about 4.7 billion U.S. dollars), a year-on-year increase of 22%, but less than analysts expected 4.08 billion euros; Net profit was 1.03 billion euros, up 38% year-on-year, slightly higher than the expected 1.02 billion euros. Chip industry-related companies represented by the Netherlands ASML and Texas Instruments in the United States released performance information on the 21st. Due to the lower than market expectations, the company's stock price fell accordingly.

In typical applications, AM243x devices can achieve this level of performance while consuming less than 1W of active power, enabling factory operators to extend power supply life and reduce operating costs and energy consumption. . The additional processing power enables designers to further analyze features such as predictive maintenance, reducing downtime on the factory floor.

The most basic structure of the BAW filter is that two metal electrodes sandwich a piezoelectric film (the thickness of the Quartz substrate is 2um at 2GHz), and the acoustic wave oscillates in the piezoelectric film to form a standing wave.

ISO7720DR Protection IC_TPS5450DDAR Power IC

GCJ188R71H473KA12D

TPS630701RNMT TPS630702RNMR TPS54218RTER TPS92692PWPR TPS56C230RJER.

(Global TMT July 13, 2021) Texas Instruments (TI) has launched a new family of high-performance microcontrollers (MCUs) that advance real-time control, network connectivity and intelligent analytics at the edge. The high-performance AM2x family closes the growing performance gap between MCUs and processors, enabling designers to push performance limits in applications such as factory automation, robotics, automotive systems, and sustainable energy management. With the new Sitara AM2x family of MCUs, engineers can use 10 times the computing power of previous flash-based MCUs.

The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. .

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

ISO7720DR Protection IC_TPS5450DDAR Power IC

In the above-mentioned BAW-SMR and FBAR?filter diagrams, sound waves propagate in the form of longitudinal waves, that is, the direction of particle vibration and the direction of wave propagation are parallel. There are also different structures where sound waves propagate as transverse waves.

Quartz (quartz), as a common piezoelectric material, exhibits linear response under high voltage and high pressure, but there is no suitable method to make quartz into thin film deposits on Si substrates. A suitable BAW piezoelectric material needs high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and also conforms to IC process technology.

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