TPSD157M016R0100 Tantalum Capacitor_ISO7741DBQR Introduction

From a regional perspective, Japan closed a larger number of fabs. It is reported that Renesas expects to close two more 150mm fabs in 2020 or 2021. Taking Renesas as an example, the company's two recently closed fabs are both 150mm, including a factory in Kochi Prefecture, Japan, which mainly produces analog, logic devices and some old-fashioned micro components. In addition, Renesas has adjusted its factory in Otsu, Shiga Prefecture, Japan, to manufacture optoelectronic devices.

Kim Wong, vice president and general manager of TI's High-Speed Data and Clocking Group, said: "The clocking requirements for future communications infrastructures will far exceed the device performance of current quartz crystal resonators. By integrating TI's BAW resonators directly into clocking devices , we can achieve ultra-low jitter performance and resiliency to meet the increasingly stringent requirements for data pipeline resistance to vibration and shock in the process of communication transformation.”

TPSD157M016R0100 Tantalum Capacitor_ISO7741DBQR

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Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say.

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

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So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers. A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production.

TPSD157M016R0100 Tantalum Capacitor_ISO7741DBQR

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In short, advances in BAW technology have brought "higher performance, simpler design, lower cost and smaller size" to wired and wireless networks, Wong explained.

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The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

TPSD157M016R0100 Tantalum Capacitor_ISO7741DBQR

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

??Membrane Type is etched from the back of the substrate to the surface (that is, the bottom electrode surface) to form a suspended thin film and a cavity. ?? There is also a method called FBAR (Film Bulk Acoustic Resonator), including Membrane type and Airgap type. .

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