NDTS0505C

  • 2022-09-23 18:12:25

NDTS0505C

EP3C80F780I7N Other passive components_NDTS0505C introduction

With the advent of 5G networks and next-generation communications technology, many sectors from business to healthcare, agriculture and education will be affected. ?? Once communications infrastructure is in place to support the transfer of large amounts of data, businesses and governments will want to provide wireless coverage for point-to-point connections over the last mile, from objects communicating with each other in warehouses to communicating smartphones, thermostats, Between heart rate monitors and many other devices.

The TI BAW oscillator is an electronic oscillator circuit that utilizes the piezoelectric effect to generate a stable electronic signal through the mechanical resonance of a vibrating miniature acoustic resonator (BAW). This precise high-frequency signal provides a clock and timing reference for electronic systems.

EP3C80F780I7N Other passive components_NDTS0505C

TPS74401RGWR Power IC

Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say.

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

TPS62823DLCR TPS62823DLCT TPS62821DLCT TPS62821DLCR BQ40Z50RSMR-R2.

DAC7311IDCKR TPS62260DDCR TPS62260DDCT TPS62261TDRVRQ1 TCA9544APWR.

EP3C80F780I7N Other passive components_NDTS0505C

LQM21NN1R0K10D

. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave.

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

When asked why nobody in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop. But it's not easy to convert electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock." TI has been involved in MEMS research for many years.

BQ24311DSGR TIC10024QDCPRQ1 TL331IDBVR TL331IDBVT TPS63070RNMT.

EP3C80F780I7N Other passive components_NDTS0505C

There are also different structures where sound waves propagate as transverse waves. In the above-mentioned BAW-SMR and FBAR?filter diagrams, sound waves propagate in the form of longitudinal waves, that is, the direction of particle vibration and the direction of wave propagation are parallel.

In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.