74HC08D, 653 logic IC_GCM219R71C105KA37D introduction

The details are shown in the figure below. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs. Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total. .

The low IQ of the TPS62840 enables 80% efficiency at 1-µA loads, 30% higher than comparable devices in the industry. . Longer battery life and very high light load efficiency: Lower IQ consumption provides longer IQ for very light loads (below 100µA) and systems operating primarily in standby/factory mode (no switching) battery life.

74HC08D, 653 logic IC_GCM219R71C105KA37D

TPS51487XRJER Other ICs

At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip. Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology.

·Selectable mode can improve performance and reduce overall cost: The selectable mode and stop function of TPS62840 can improve noise performance and reduce signal distortion. These advantages can help reduce solution cost because designers do not need to use more expensive precision signal chain components, sensors or radio solutions to perform the same function to achieve system requirements. .

In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: . For the first time in the industry, TI uses this technology for integrated clock functions. • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones.

Thanks to these features and its selectable functions, the TPS62840 helps engineers overcome key design challenges in many battery-operated, continuous-run industrial and personal electronics applications, including narrowband IoT, grid infrastructure equipment, and renewable energy. Wearables, they all require greater flexibility and precision, wider wireless range, and reduced electromagnetic interference (EMI).

74HC08D, 653 logic IC_GCM219R71C105KA37D

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TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

One way is to form a Bragg reflector under the oscillating structure to reflect sound waves into the piezoelectric layer. The overall effect of this structure is equivalent to contact with air, and most of the sound waves are reflected back. This structure is called BAW-SMR (Solidly Mounted Resonator), as shown below. The reflector consists of several layers of alternating high and low impedance layers. For example, the first layer has a large acoustic wave impedance, the second layer has a small acoustic wave impedance, and the third layer has a large acoustic wave impedance, and the thickness of each layer is λ/4 of the acoustic wave, so that most of the wave will be reflected back and superimposed with the original wave.

. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave.

74HC08D, 653 logic IC_GCM219R71C105KA37D

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention. In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and finally the auxiliary layer is removed to form an air gap under the oscillating structure.

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