LM4040AIM3X-4.1/NOPB Power IC_GJM1555C1HR70WB01D Introduction

In April 2019, Texas Instruments released the construction plan for this 300mm fab, with an estimated investment of $3.1 billion. However, in view of the sluggish semiconductor market in 2019 and the unsatisfactory revenue situation, TI's plan to invest in the construction of a 300mm wafer fab in Richardson is not as smooth as originally expected, and it may be delayed for two years to complete.

. The newly introduced C2000 F2838x microcontrollers, however, do not rely on external ASICs, thereby reducing the overall solution size and the amount of material used. Systems with a communication interface often require an external application-specific integrated circuit (ASIC) or a dedicated host-controlled microprocessor, but this reduces the flexibility of the design architecture, increases complexity, and takes up space on the circuit board.

LM4040AIM3X-4.1/NOPB Power IC_GJM1555C1HR70WB01D

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"Quartz crystals require additional components to extend their accuracy -- over time -- as their performance changes beyond controllable temperature changes," he added. In addition, Solis said, "using a BAW resonator is more efficient than using a quartz crystal. precise.

A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production. So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers.

In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: . For the first time in the industry, TI uses this technology for integrated clock functions. • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones.

LM4040AIM3X-4.1/NOPB Power IC_GJM1555C1HR70WB01D

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"The new BAW resonator technology is important because TI is integrating it into its silicon products, reducing design time, solution size and component cost," said Philip Solis, research director for connectivity and smartphone semiconductors at IDC.

. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave.

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LM4040AIM3X-4.1/NOPB Power IC_GJM1555C1HR70WB01D

There are many types of BAW filters, including ladder type filter, lattice type filter, stacked crystal filter and coupled resonator filter. The BAW filter can connect multiple resonators according to a certain topology. Only the ladder type and lattice type are briefly introduced here.

TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. . Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals.

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