878321414_AD1886JST-REEL Introduction

The low IQ of the TPS62840 enables 80% efficiency at 1-µA loads, 30% higher than comparable devices in the industry. . Longer battery life and very high light load efficiency: Lower IQ consumption provides longer IQ for very light loads (below 100µA) and systems operating primarily in standby/factory mode (no switching) battery life.

Combining EtherCAT, Ethernet and CAN FD: In terms of galvanically isolated architecture, the new microcontrollers feature a fast serial interface with 8 receive channels, enabling chip-to-chip communication at speeds up to 200 Mbps with fewer pins. .

878321414_AD1886JST-REEL

AD1884JCPZ

Stop pins turn off all switches to reduce EMI or ripple and minimize distortion passed to precision signal chains, measurements, sensors or wireless connected components. The mode pin allows continuous conduction mode (also known as forced pulse width modulation mode) to improve ripple or noise performance and reduce the impact on transmission in sensitive RF applications. .

In the semiconductor industry, digital IC technology is difficult and pursues excellent efficiency. Therefore, the often-discussed 7nm, 5nm, and 3nm refer to the process used in digital IC manufacturing, which is mainly controlled by a few multinational companies. It is extremely low, so it has become an area that the market pays more attention to. .

So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers. A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production.

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

878321414_AD1886JST-REEL

AD210BN

TPS630701RNMT TPS630702RNMR TPS54218RTER TPS92692PWPR TPS56C230RJER.

The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. .

DRV8876NPWPR DRV8872DDARQ1 DRV5013ADQDBZT DRV5013ADQDBZR TPD4E001DRLR.

The overall effect of this structure is equivalent to contact with air, and most of the sound waves are reflected back. This structure is called BAW-SMR (Solidly Mounted Resonator), as shown below. One way is to form a Bragg reflector under the oscillating structure to reflect sound waves into the piezoelectric layer. The reflector consists of several layers of alternating high and low impedance layers. For example, one layer has a large acoustic wave impedance, the second layer has a small acoustic wave impedance, and the third layer has a large acoustic wave impedance, and the thickness of each layer is λ/4 of the acoustic wave, so that most waves will The reflected back and the original wave are superimposed.

878321414_AD1886JST-REEL

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

. Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals.

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