ACA2604R_AD1895AYRSZ Introduction

From a regional perspective, Japan closed a larger number of fabs. In addition, Renesas has adjusted its factory in Otsu, Shiga Prefecture, Japan, to manufacture optoelectronic devices. Taking Renesas as an example, the company's two recently closed fabs are both 150mm, including a factory in Kochi Prefecture, Japan, which mainly produces analog, logic devices and some old-fashioned micro components. It is reported that Renesas expects to close two more 150mm fabs in 2020 or 2021.

Among them, 42 150mm fabs and 24 200mm fabs were closed, while the number of closed 300mm fabs accounted for only 10% of the total. . The details are shown in the figure below. According to IC Insights statistics, in the past 10 years (2009-2018), all 11-ball semiconductor manufacturers closed or rebuilt a total of 97 fabs.

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Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

Stop pins turn off all switches to reduce EMI or ripple and minimize distortion passed to precision signal chains, measurements, sensors or wireless connected components. The mode pin allows continuous conduction mode (also known as forced pulse width modulation mode) to improve ripple or noise performance and reduce the impact on transmission in sensitive RF applications. .

Due to its wide application, analog chips are less affected by a single downstream boom. From the historical data, from 2000 to 2017, the volatility of analog chips was 1.8%, while the volatility of typical cyclical industry memory over the same period was as high as 6.7%.

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

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The overall effect of this structure is equivalent to contact with air, and most of the sound waves are reflected back. This structure is called BAW-SMR (Solidly Mounted Resonator), as shown below. One way is to form a Bragg reflector under the oscillating structure to reflect sound waves into the piezoelectric layer. The reflector consists of several layers of alternating high and low impedance layers. For example, one layer has a large acoustic wave impedance, the second layer has a small acoustic wave impedance, and the third layer has a large acoustic wave impedance, and the thickness of each layer is λ/4 of the acoustic wave, so that most waves will The reflected back and the original wave are superimposed.

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However, converting electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy. "TI has been involved in MEMS for years. When asked why no one in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop.

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. Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals.

For more information, read the article "Universal fast charging is the future of battery charging applications. On-the-go (OTG) charging is supported through forward and reverse bidirectional operation of the charging IC.".

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