ACD2206S8P1_AD1896AYRS Introduction

In April 2019, Texas Instruments released the construction plan for this 300mm fab, with an estimated investment of $3.1 billion. However, in view of the sluggish semiconductor market in 2019 and the unsatisfactory revenue situation, TI's plan to invest in the construction of a 300mm wafer fab in Richardson is not as smooth as originally expected, and it may be delayed for two years to complete.

In April 2019, Diodes completed the acquisition of Texas Instruments' 150mm/200mm wafer fab (GFAB) in Greenock, Scotland, UK, as part of TI's strategy to gradually abandon outdated capacity. Texas Instruments currently has 15 wafer fabs in 9 countries, of course, these plants include outdated capacity that is about to close, as well as new 300mm capacity.

ACD2206S8P1_AD1896AYRS

ACA1206RS7P2

. The BQ25792 is available in a 4mm x 4mm, 29-pin QFN package and is available now from TI and authorized resellers. Complete reels and custom reels are available on TI.com and through other channels, starting in 1,000 pieces. The BQ25790 is available in a 2.9mm x 3.3mm, 56-pin WCSP package and is available now from TI and its authorized resellers.

Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip.

The basic structure of the BAW filter is that two metal electrodes sandwich a piezoelectric film (the thickness of the Quartz substrate is 2um at 2GHz), and the acoustic wave oscillates in the piezoelectric film to form a standing wave.

Flexible VIN broadens application range: The TPS62840 has a wide input voltage range of 1.8VIN-6.5VIN and accepts a variety of chemistries and configurations, such as two lithium-manganese dioxide (2s-LiMnO2) cells in series , single-cell lithium thionyl chloride (1xLiSOCL2) batteries, four- and two-cell alkaline batteries, and lithium polymer batteries (Li-Po).

ACD2206S8P1_AD1896AYRS

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TPS630701RNMT TPS630702RNMR TPS54218RTER TPS92692PWPR TPS56C230RJER.

TPS60403DBVR CSD17313Q2 TPS259571DSGR TPS259571DSGT TLV3202AQDGKRQ1.

However, converting electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy. "TI has been involved in MEMS for years. When asked why no one in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop.

The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. .

ACD2206S8P1_AD1896AYRS

The reduction in component count is valuable for applications such as smart speakers; and as market adoption increases, the size and cost of these applications continue to shrink. The charger can provide a power density of 155 mW/mm2 (100 W/in2), which is about twice higher than the market. . The new buck-boost charger helps engineers reduce solution size and bill of materials (BOM) and is TI's first device to fully integrate the following components: switching metal-oxide-semiconductor field-effect transistor (MOSFET), charge path management FETs, input current and charge current sensing circuits, and dual input select drivers.

The resonator used in the Ladder type (SAW is also mentioned later) includes series and parallel. A series resonator plus a parallel resonator is called a stage, and the entire ladder type filter can be composed of several stages. .

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