AD1139JD_AD1981BJST-REEL Introduction

The TPS62840 joins TI's portfolio of highly integrated low-IQ DC/DC converters, enabling designers to maximize power output in the smallest possible solution size.

In April 2019, Diodes completed the acquisition of Texas Instruments' 150mm/200mm wafer fab (GFAB) in Greenock, Scotland, UK, as part of TI's strategy to gradually abandon outdated capacity. Texas Instruments currently has 15 wafer fabs in 9 countries, of course, these plants include outdated capacity that is about to close, as well as new 300mm capacity.

AD1139JD_AD1981BJST-REEL

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. The BQ25792 is available in a 4mm x 4mm, 29-pin QFN package and is available now from TI and authorized resellers. Complete reels and custom reels are available on TI.com and through other channels, starting in 1,000 pieces. The BQ25790 is available in a 2.9mm x 3.3mm, 56-pin WCSP package and is available now from TI and its authorized resellers.

The F2838x microcontrollers integrate three industrial communication protocols, enabling designers to tailor a microcontroller to the specific needs of each system. A key component required to achieve this is a new connection manager based on the Arm® Cortex®-M4 subsystem, which reduces some of the processing-intensive communications and optimizes connectivity.

Stop pins turn off all switches to reduce EMI or ripple and minimize distortion passed to precision signal chains, measurements, sensors or wireless connected components. The mode pin allows continuous conduction mode (also known as forced pulse width modulation mode) to improve ripple or noise performance and reduce the impact on transmission in sensitive RF applications. .

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

AD1139JD_AD1981BJST-REEL

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TPS65400RGZR TPS65400RGZT TPS92515QDGQRQ1 TPS92515QDGQTQ1 TPS560430XFDBVT.

LM5176PWPR LM5176PWPT DRV8876PWPR TPS23751PWPR TPS61194PWPR.

The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

AD1139JD_AD1981BJST-REEL

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

. Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals.

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