AD1170_AD1981BJSTZ Introduction

The TPS62840 joins TI's portfolio of highly integrated low-IQ DC/DC converters, enabling designers to maximize power output in the smallest possible solution size.

In the analog chip market, manufacturers like TI, ADI, and Maxim all have gross profit margins higher than the industry average. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018. According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs. The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%.

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For the first time in the industry, TI uses this technology for integrated clock functions. In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: . • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones.

In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal. "Everyone uses quartz crystals for clocks," Solis said.

The F2838x microcontrollers integrate three industrial communication protocols, enabling designers to tailor a microcontroller to the specific needs of each system. A key component required to achieve this is a new connection manager based on the Arm® Cortex®-M4 subsystem, which reduces some of the processing-intensive communications and optimizes connectivity.

Texas Instruments has unveiled what the company calls "breakthrough" bulk acoustic wave (BAW) resonator technology. At just 100 microns in size, these tiny timers are smaller than the diameter of a human hair, but they operate at much higher frequencies than quartz crystals, enabling the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuitry, TI say. This enables TI to introduce the industry's first crystalless wireless MCU for the embedded market, the SimpleLink CC2652RB, with the clock contained in the same chip.

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The overall effect of this structure is equivalent to contact with air, and most of the sound waves are reflected back. This structure is called BAW-SMR (Solidly Mounted Resonator), as shown below. One way is to form a Bragg reflector under the oscillating structure to reflect sound waves into the piezoelectric layer. The reflector consists of several layers of alternating high and low impedance layers. For example, one layer has a large acoustic wave impedance, the second layer has a small acoustic wave impedance, and the third layer has a large acoustic wave impedance, and the thickness of each layer is λ/4 of the acoustic wave, so that most waves will The reflected back and the original wave are superimposed.

UCC28063DR LM536003QDSXRQ1 UCC2892DR MSP430FR2111IPW16R UCC21520QDWRQ1.

DRV8876NPWPR DRV8872DDARQ1 DRV5013ADQDBZT DRV5013ADQDBZR TPD4E001DRLR.

LM5176PWPR LM5176PWPT DRV8876PWPR TPS23751PWPR TPS61194PWPR.

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There are also different structures where sound waves propagate as transverse waves. In the above-mentioned BAW-SMR and FBAR?filter diagrams, sound waves propagate in the form of longitudinal waves, that is, the direction of particle vibration and the direction of wave propagation are parallel.

The reduction in component count is valuable for applications such as smart speakers; and as market adoption increases, the size and cost of these applications continue to shrink. The charger can provide a power density of 155 mW/mm2 (100 W/in2), which is about twice higher than the market. . The new buck-boost charger helps engineers reduce solution size and bill of materials (BOM) and is TI's first device to fully integrate the following components: switching metal-oxide-semiconductor field-effect transistor (MOSFET), charge path management FETs, input current and charge current sensing circuits, and dual input select drivers.

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