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  • 2022-09-23 18:12:25

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AD1580ARTZ-REEL7_AD1988AJCPZ-RL Introduction

Systems with a communication interface often require an external application-specific integrated circuit (ASIC) or a dedicated host-controlled microprocessor, but this reduces the flexibility of the design architecture, increases complexity, and takes up space on the circuit board. . The newly introduced C2000 F2838x microcontrollers, however, do not rely on external ASICs, thereby reducing the overall solution size and the amount of material used.

For example, video doorbells that normally rely on AC power to operate can be guaranteed when the main power source is switched to a battery pack. Packaging and Availability. TI's chargers help reduce power consumption through heat dissipation, allowing video doorbells to last longer with their batteries.

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In order to gain an in-depth understanding of TI's new breakthrough in BAW technology, let's start with the principle of BAW filter: . • In the past, BAW resonator technology has been used to filter signals in communication technologies such as smartphones. For the first time in the industry, TI uses this technology for integrated clock functions.

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers. A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production.

Flexible VIN broadens application range: The TPS62840 has a wide input voltage range of 1.8VIN-6.5VIN and accepts a variety of chemistries and configurations, such as two lithium-manganese dioxide (2s-LiMnO2) cells in series , single-cell lithium thionyl chloride (1xLiSOCL2) batteries, four- and two-cell alkaline batteries, and lithium polymer batteries (Li-Po).

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"The new BAW resonator technology is important because TI is integrating it into its silicon products, reducing design time, solution size and component cost," said Philip Solis, research director for connectivity and smartphone semiconductors at IDC.

"TI has been involved in MEMS for years. When asked why no one in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop. However, converting electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy.

The propagation speed of sound waves in solids is ~5000m/s, which means that the acoustic impedance of solids is about 105 times that of air, so 99.995% of the sound wave energy will be reflected back at the boundary between the solid and the air, which is the same as the original wave (incident wave). together to form a standing wave. On the other side of the oscillating structure, the acoustic impedance of the piezoelectric material is not much different from that of other substrates (such as Si), so the piezoelectric layer cannot be deposited directly on the Si substrate. In order to keep the acoustic wave in the piezoelectric film to oscillate, there must be sufficient isolation between the oscillating structure and the external environment to obtain a small loss and a large Q value. .

TPS60403DBVR CSD17313Q2 TPS259571DSGR TPS259571DSGT TLV3202AQDGKRQ1.

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The particles in the solid vibrate in an elliptical trajectory, and the long axis of the ellipse is perpendicular to the surface of the solid. For SAW, also called Rayleighsurface wave, there are both longitudinal waves and transverse waves. .

TI's new newer SimpleLink™ multi-standard MCUs with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

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