AD1584BRTZ_AD22100KT Introduction

In April 2019, Texas Instruments released the construction plan for this 300mm fab, with an estimated investment of $3.1 billion. However, in view of the sluggish semiconductor market in 2019 and the unsatisfactory revenue situation, TI's plan to invest in the construction of a 300mm wafer fab in Richardson is not as smooth as originally expected, and it may be delayed for two years to complete.

With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab. .

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Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

"Everyone uses quartz crystals for clocks," Solis said. In this case, BAW resonator technology offers TI a huge advantage by eliminating the need for external components mounted on the PCB. Today, timing often requires a quartz crystal.

So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers. A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production.

Analog Devices leverages its unique domain application expertise to play an important role in end-use applications and positively impact customers' businesses. ADI's advances in software are deeply influencing how customers choose and use their solutions. .

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As part of the research initiation part of the UL initiative, ADI will fund experimental development and research with a view to developing new software processes and services. . In the context of the increasing global demand for development talents and the rapid growth of the Internet economy, ISE aims to transform the way computer science is taught and cultivate industry-experienced software professionals to have a greater impact on the business.

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"The new BAW resonator technology is important because TI is integrating it into its silicon products, reducing design time, solution size and component cost," said Philip Solis, research director for connectivity and smartphone semiconductors at IDC.

The reflector consists of several layers of alternating high and low impedance layers. For example, one layer has a large acoustic wave impedance, the second layer has a small acoustic wave impedance, and the third layer has a large acoustic wave impedance, and the thickness of each layer is λ/4 of the acoustic wave, so that most waves will The reflected back and the original wave are superimposed. The overall effect of this structure is equivalent to contact with air, and most of the sound waves are reflected back. This structure is called BAW-SMR (Solidly Mounted Resonator), as shown below. One way is to form a Bragg reflector under the oscillating structure to reflect sound waves into the piezoelectric layer.

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Wireless networks are at the heart of this data migration, and the ability to connect the last mile through connected devices is a key part of the data loop. "Making accurate, informed decisions through the use and analysis of large amounts of data is a very important innovation capability," said Ray Upton, vice president of TI's Interconnect Microcontroller Group.

?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention. In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure.

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