AD1584BRTZ_AD22100KT Introduction

With the maturity and progress of the process technology and the increase in market demand, more and more companies use advanced processes below 20nm to design and produce ICs and devices, which makes more and more IDMs and foundries eliminate low-efficiency production. fab. .

According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs. The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%. In the analog chip market, manufacturers like TI, ADI, and Maxim all have gross profit margins higher than the industry average. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018.

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So, does this mean that 150mm wafers are gradually withdrawing from the stage of history? The answer is no, there is still a huge market space for 150mm wafers. A large number of 150mm fabs in the industry were closed, and more and more 300mm fabs were launched and gradually achieved mass production.

A key component required to achieve this is a new connection manager based on the Arm® Cortex®-M4 subsystem, which reduces some of the processing-intensive communications and optimizes connectivity. The F2838x microcontrollers integrate three industrial communication protocols, enabling designers to tailor a microcontroller to the specific needs of each system.

Ray Upton, TI's vice president of connected microcontrollers, explained that new technologies are critical to "moving large amounts of data in a stable manner," improving high-performance communications. .

The BQ25790 is available in a 2.9mm x 3.3mm, 56-pin WCSP package and is available now from TI and its authorized resellers. The BQ25792 is available in a 4mm x 4mm, 29-pin QFN package and is available now from TI and authorized resellers. Complete reels and custom reels are available on TI.com and through other channels, starting in 1,000 pieces. .

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TPS560430XFDBVR XTR117AIDGKR CSD15380F3T MSP-EXP432P401R TPS2051BDBVR.

TPS63060DSCR TPS63030DSKR TPS63060DSCT TPS63070RNMR TPS630701RNMR.

The technology, which also enables high-precision and robust communication between IoT devices, can now be developed in a less bulky form, said Kim Wong, vice president of high-speed data and clocking at TI.

"TI has been involved in MEMS for years. When asked why no one in the industry has built something like a BAW resonator, Upton said, "It's very difficult to develop. However, converting electrical energy into mechanical acoustics while keeping the signal stable and robust within a clean clock is not easy.

AD1584BRTZ_AD22100KT

?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention. In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure.

The working principle is as shown below. The typical basic structure is shown in the figure (a) above, with the piezoelectric layer sandwiched between the upper and lower metal electrodes, the corresponding mBVD equivalent circuit is shown in the figure (b) above, and the corresponding impedance is shown in the figure (c) above. It can be seen that there are two resonance frequencies, series (fs) and parallel (fp).

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