AD1582ARTZ-REEL7_AD203SN Introduction

In the analog chip market, manufacturers like TI, ADI, and Maxim all have gross profit margins higher than the industry average. Take TI as an example, its profits and profit margins have maintained an upward trend over the past 10 years and reached new highs in 2018. According to TI, creating high profit margins is related to their use of 12-inch fabs to produce analog chips and reduce costs. The data shows that TI's analog chips had an operating profit margin of 46.7% in 2018, but the operating profit margin of embedded processors was only 29.6%.

John Collison, Co-Founder and President of Stripe, said: "Software engineers have a high passion for this amazing profession and they can solve some of the most important global problems in those fast-growing industries, but the number of software engineers currently Far from enough.

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We deeply appreciate the importance of programs such as ISE in helping to develop the software engineers of tomorrow.” said Vincent Roche, President and CEO of Analog Devices, Inc. “ADI is committed to enhancing the impact of software development across industries, and with its own unique advantages of bridging the real and digital worlds. .

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A cohort of students is expected to enroll in ISE courses in September 2022. Through industry placements, students gain experience working in companies (which make up nearly half of the total coursework), allowing them to acquire the skills they need in a real work environment under the guidance of a mentor. .

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. As part of the research initiation part of the UL initiative, ADI will fund experimental development and research with a view to developing new software processes and services. In the context of the increasing global demand for development talents and the rapid growth of the Internet economy, ISE aims to transform the way computer science is taught and cultivate industry-experienced software professionals to have a greater impact on the business.

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In the Airgap type, an auxiliary layer (sacrificial support layer) is deposited before the piezoelectric layer is formed, and then the auxiliary layer is removed to form an air gap under the oscillating structure. ?? Because only the edge part is in contact with the underlying substrate, this structure is relatively fragile when under pressure, and similar to the membrane type, the heat dissipation problem also needs attention.

Appropriate BAW piezoelectric materials require high electromechanical coupling coefficient, low electromechanical loss, high thermal stability, and conform to IC process technology. As a common piezoelectric material, quartz exhibits a linear response under high voltage and high pressure, but there is no suitable method to make quartz into a thin film deposit on a Si substrate.

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