AD1585BRTZ_AD22003BP Introduction

Systems with a communication interface often require an external application-specific integrated circuit (ASIC) or a dedicated host-controlled microprocessor, but this reduces the flexibility of the design architecture, increases complexity, and takes up space on the circuit board. . The newly introduced C2000 F2838x microcontrollers, however, do not rely on external ASICs, thereby reducing the overall solution size and the amount of material used.

The low IQ of the TPS62840 enables 80% efficiency at 1-µA loads, 30% higher than comparable devices in the industry. Longer battery life and very high light load efficiency: Lower IQ consumption provides longer IQ for very light loads (below 100µA) and systems operating primarily in standby/factory mode (no switching) battery life. .

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Compared with 4G, 5G has clearly planned three application scenarios at the initial stage: enhancing mobile broadband, its peak rate will be more than 10 times that of 4G network; massive machine communication will realize the whole process from consumption to production, from human to human. Full scene coverage to objects; ultra-reliable and low-latency communication, the communication response speed will be reduced to millisecond level. . However, 5G is not limited to mobile phones. In the era of the Internet of Everything, highways must be built in advance. Therefore, 5G is indisputably the first of new infrastructure.

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Time-to-market is accelerated as designers eliminate the need to screen, calibrate and assemble external quartz crystals. TI's new product announcement includes an industry-first crystalless wireless microprocessor (MCU) that integrates a TI BAW resonator in a package. . Design engineers can use this MCU to achieve simpler and smaller designs while improving performance and reducing cost.

TI's newest SimpleLink™ multi-standard MCU with ?BAW technology can be integrated into low-power wireless RF devices, such as low-power crystalless Bluetooth and Zigbee? technology, thereby reducing wireless RF failures caused by external crystals.

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