parameter name property value

Brand_NameNXP Semiconductor

Whether Rohs certification meets

Parts Packaging Code TO-220

Packing InstructionsFLANGE MOUNT, R-PSFM-T3

stitch number 3

Manufacturer Packing Code SOT78A

Reach Compliance Codenot_compliant

Other features AVALANCHE RATED

Avalanche Energy Efficiency Rating (Eas) 1405 mJ

Shell connection DRAIN

CONFIGURATION SINGLE WITH BUILT-IN DIODE

Minimum drain-source breakdown voltage 30 V

Maximum drain current (Abs) (ID) 120 A

Maximum drain current (ID) 120 A

Maximum drain-source on-resistance 0.0016 Ω

parameter name property value

Whether Rohs certification meets

Package Instructions 20 X 20 MM, 1.40 MM HEIGHT, 0.65 MM PITCH, MS-026BFA, LQFP-112

Reach Compliance Codecompliant

ECCN code 3A991.A.2

with ADCYES

address bus width

Bit size 16

CPU seriesCPU12

Maximum clock frequency 40 MHz

DAC channel YES

DMA channel NO

External data bus width

JESD-30 Code S-PQFP-G112

length 20 mm

Number of I/O lines 91

Number of terminals 112

Maximum operating temperature 105 °C

Minimum operating temperature -40 °C

PWM channel YES

Package body material PLASTIC/EPOXY

Package code LQFP

Package equivalent code QFP112,.87SQ

Package shape SQUARE

Package FLATPACK, LOW PROFILE

Power supply 3.3/5 V

Certification StatusNot Qualified

RAM (bytes) 12288

ROM (word) 262144

ROM Programmable FLASH

Screening level AEC-Q100

Maximum seat height 1.6 mm

Speed 40 MHz

Maximum supply voltage 1.98 V

Minimum supply voltage 1.72 V

Nominal supply voltage 1.8 V

Surface MountYES

Technology CMOS

Temperature class INDUSTRIAL

Terminal form GULL WING

Terminal pitch 0.65 mm

Terminal position QUAD

width 20 mm

uPs/uCs/peripheral IC type MICROCONTROLLER