TMS3TCI6486BZTZ625

TMS3TCI6486BZTZ625 parameter name property value

Objectid1104144834

Parts Package Code BGA

Package DescriptionFBGA, BGA737,29X29,32

Number of needles 737

Reach Compliance Codeunknown

ECCN code 3A001.A.3

address bus width

Barrel shifterNO

Bit size 32

Boundary Scan YES

Maximum clock frequency 50 MHz

External data bus width

Format FIXED POINT

Internal bus architecture MULTIPLE

JESD-30 Code S-PBGA-B737

length 24 mm

Low power mode YES

Number of terminals 737

Maximum operating temperature 85 °C

Minimum operating temperature

Package body material PLASTIC/EPOXY

Package code FBGA

Package Equivalent Code BGA737,29X29,32

Package shape SQUARE

Package GRID ARRAY, FINE PITCH

Power 1, 1.2, 1.8, 3.3 V

Certification StatusNot Qualified

RAM (word count) 8192

Maximum seat height 3.242 mm

Maximum supply voltage 1.16 V

Minimum supply voltage 1.05 V

Nominal supply voltage 1.1 V

Surface MountYES

Technology CMOS

temperature class OTHER

Terminal form BALL

Terminal pitch 0.8 mm

Terminal position BOTTOM

width 24 mm

uPs/uCs/peripheral IC type DIGITAL SIGNAL PROCESSOR, OTHER

TMS3TCI6486BZ...