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RT9080N-08GJ5

SR2100

CXT5401

2SD1782

MMBT3906T/SOT-523

PZTA44, TO-223

MBR0520-R2

BZX84C18

MMBD7000 M5C

VS-1EFH02HM3/I

BZT52C7V5

BZX84C10 SOT23

BZT52C16

MM3Z3V6T1G SOD-323

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X9C102S

MMBZ27VCLT1 SOT23

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1N4148WSF-7 SOD-323

BC846BLT1 SOT23

STM32F072CBT6

STM32F101VFT6TR

STM32F030C8T6

STM32F207VGT6

STM32F405VGT6

STM32F207VGT6

STM32F101VFT6TR

STM32F072CBT6

BAT54S, 215 SOT-23

FMMT591

BC846BLT1 SOT23

MMBT5401LT1G SOT-23

SMMBT4403LT1G SOT-23

SMMBT5551LT1G QS-SOT23

MMBT7002 SOT-23

MCP4725A0T-E/CH

Type: DAC, digital-to-analog conversion chip

Manufacturer: Microchip

Resolution: 12bit

Working voltage: 2.7V-5.5V

Working current: 400uA max.

Interface: I2C

Operating temperature: -40゜C ~ +125゜C

Package: SOT23-6

Differential Nonlinearity (DNL): plus or minus 0.2 LSB

Address bits: A0

Built-in EEPROM, CODE can be stored when power off

The converter chip includes an A/D converter chip and a D/A converter chip. An analog-to-digital converter is an A/D converter, or ADC for short. A stands for analog and D stands for digital. It usually refers to an electronic component that converts an analog signal into a digital signal. A digital-to-analog converter, also known as a D/A converter, or DAC for short, is a device that converts digital quantities into analog.

Chinese name converter chip Foreign name converter chip Classification A/D converter chip and D/A converter chip Application field Computer, database and other main parameters Analog output, working mode, etc. Working mode Single buffer, multi buffer, etc.

Table of contents

1 Product Information

2 Product Features

3 way of working

4 How it works

5 Product Category

Editing of product information

DAC0832 is an 8-bit D/A conversion chip, as shown in Figure lo-5. It has double input buffers on-chip and outputs in the form of current. The required settling time is 1Ms and the power consumption is 20mW. [2]

Product function editor

D0~D7: Input data lines.

ILE: Enable input latch signal, ILE=1, enable latch.

LE1, LE2: The latch signal of the input register, when LE1=1, the output of the 8-bit input register changes with the input; when LE1=0, the data is latched in the 8-bit input register. Whether D/A conversion can be performed also depends on LE2. When LE2=1, the data is sent to the output of the 8-bit DAC register. When LE2=0, the data is latched in the 8-bit DAC register and D/A conversion is started.

CS: Chip select signal, active low.

WR1: Input register write strobe signal, active low. When ILE=1 and CS is low, when WR1 transitions from low level to high level, the data is latched into the 8-bit input register.

XFER data transfer control signal, active low.

WR2: DAC register write strobe signal, active low.

When XFER is low and WR2 transitions from low level to high level, the data is latched into the 8-bit DAC register to start D/A conversion.

Iout1: DAC output current 1.

Iout2: DAC output current 2.

Rfb: Feedback signal input line, provides a feedback voltage for the external amplifier, Rm can be provided internally, or an external resistor can be used.

Vrtf: Reference voltage input line, the range is a 10V ~ +10V.

Vcc: Power line, generally +5V~+15V.

AGND analog ground.

DGND digital ground.

AGND and DGND are two grounds of different nature and should be connected separately. Under normal circumstances, these two grounds are only connected together at the end to improve the anti-interference ability.

How it worksEdit

The DAC0832 has a double input buffer on-chip, and it has three working modes.

①Single buffer. This method is used in the case of one or more analog outputs that are not synchronized. Implemented with one of the two registers passthrough and the other controlled.

② Double buffer. This method is used in the case of multi-channel analog synchronous output. Both registers are controlled during implementation. First, the 8-bit input registers of the multi-channel DAC0832 respectively receive data, and then control the multi-channel DAC0832 to transmit the data to the DAC register at the same time. In order to realize the synchronous output of multi-channel analog quantity.

③ Straight through. This method is suitable for continuous feedback control circuit, so that ILE, CS, WR1, WR2, XFER are all valid.

Analog output

①Unipolar output. DAC0832 is a current type output. If a voltage output is required, just connect an operational amplifier, as shown in the figure.

In the figure, Iout2 is grounded, and Iout1 is connected to the inverting input terminal of the amplifier, so the output voltage U is in an inverse phase with the reference voltage Vrcf. When Vrcf is connected to a 5V, the output voltage range is o ~ +5V.

②Bipolar output. On the basis of the unipolar circuit, a first-stage amplifier is added. It constitutes a bipolar voltage output, as shown on the right.

How it worksEdit

DAC1210 is a 12-bit D/A conversion chip with double input buffer, current output, pin/internal structure as shown in the figure. Different from DAC0832, in addition to 4 more data lines, there is a high-low-bit selection signal B1/B2. When the signal is high, an 8-bit input register is selected, and the low-bit register is not controlled by B1/B2. Therefore, when writing 12-bit data, double-buffering should be used, that is, the upper 8-bit data is written for the first time, and the lower four-bit data is written for the second time.

Conversion time refers to the time required for the A/D converter to complete one conversion.

Product CategoryEdit

Structure and main indicators of ADC0809

ADC0809 is an 8-bit successive approximation A/D converter. As shown in the figure, there is an 8-bit successive approximation A/D converter.

Approximate A/D converter, 8 analog switches, address latch and decoding logic, etc. There are 8 analog switches in the chip, and 8 analog inputs can be selected.

main indicators

Resolution - 8 bits.

Conversion time - 100υs.

Clock frequency - typical value 640kHz (10kHz ~ 1280kHz).

Total Unadjustable Error - ±1 LSB.

Analog input range——0～+5V.

Working temperature - -40 ~ +85 ℃.

8-way analog switch with latch control.

The output has a three-state buffer, which is easy to connect with a microcomputer.

The output has a three-state buffer, which is easy to connect with a microcomputer.

pin

The pins of ADC0809 are shown in Figure 10-18.

IN7～IN0: 8 analog input signals.

ADDA, ADDB, ADDC: Address selection.

ALE: address latch signal, positive transition address latch.

START: Start the conversion signal, the rising edge of the signal clears the internal register, and the falling edge starts the A/D to start conversion.

EOC: conversion end signal, output a positive pulse with a width of 8 CLK cycles at the end of conversion.

OE: output enable signal, the result of high-level conversion is sent to the data line.

VREF+, VREF-: Reference voltage.

D0~D7: 8-bit three-state data output line.

CLK: Conversion clock. Typically 640kHz.

Vcc: Power +5V.

Working timing

The working sequence of ADC0809 is shown in the figure. A/D conversion is started by a positive pulse of the START signal. After 2υs and 8 clock cycles after the rising edge, the EOC signal will become low, indicating that the conversion is in progress, and EOC will become high after the conversion is over.

Structure and main specifications of AD574A

AD574A is a 12-bit successive approximation A/D converter, as shown in the figure, it includes

A 12-bit D/A converter, reference power supply, successive approximation register, conversion control circuit, clock, bus interface and high performance comparator.

The main indicators are as follows

Resolution - 12 bits.

Conversion time - 25υs.

Nonlinearity Error - ±1LSB for AD574AJ and ±1/2LSB for AD574AK.

Analog input range——0～+10V, 0～+20V, ±5V, ±10V.

Power Consumption - Typical 390mW.

Reference power supply - there is a high-precision reference voltage inside, just connect a suitable resistor.

Interface - There are output tri-state buffers, which can directly interface with 8-bit or 16-bit microprocessors.

pin

AD574A pins

DB11~DB0: 12-bit digital output.

10Vin: Analog 10V range input.

20Vin: Analog 20V range input.

BIP: Bipolar bias, when grounded, choose unipolar connection; if bipolar connection is used, it should be connected to one end of a potentiometer, and the other end of the potentiometer is connected to Rout.

CS: Chip select signal, active low.

CE: chip enable signal, active high.

A0: Select the length of the conversion data. At startup, A0=0, which means 12-bit conversion; A0=1, which means 8-bit conversion. When reading data, A0=0 means reading the upper 8 bits; A0=1 means reading the lower 4 bits.

R/C: read/start conversion signal, low level means start conversion; high level means output data.

12/8: Select the data output format. When 12/8=1, it means to read 12-bit data. When 12/8=0, it means to read the data in two times by adding the upper 8 bits and the lower 4 bits. .

STS: Output status signal, which becomes high level at the beginning of conversion, and remains high level during conversion. End of conversion goes low.

Rin and Rout: Reference voltage input and output terminals. Generally, a 100Ω resistor or potentiometer is connected between the two.

RGA220M1HBK-0511

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FH26-45S-0.3SHW(05)

FH19C-8S-0.5SH(05)

AXK724247G

FH19-6S-0.5SH(49)

FH26-39S-0.3SHW(05)

FH26-51S-0.3SHW(05)

DF30FC-24DS-0.4V

AXT530124

MSP430F2001IRSAR

RDA5802E

SSP-T7-F

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SKY77701-12

SKY77190

SAWEN881MCY0F00R15

7M26000028

OZ8806LN-C-0-TR

NT3225SA

E3SB24.0000F15E22

E3SB37.4000F12E11

FH26W-31S-0.3SHW(05)

RF7163

BMA250

FAR-D5PE-881M50-P3EY-Z

AXT516124

WP3-S024VA1-R600

FPC 0.5 08P(0.9H)

PF030-205B-C10-H

MT6582V/XA

MT6605N/B

MT6290MA/P

MT6290MA/F

MT6331P

MT6332P

SKY77761-12

MT6169V

ACPF-7041-TR1

SKY77192-14

SAYEV836MAD0F00R05

SAYFP1G95AA0B00R05

FAR-D5NA-881M50-P1A2

FAR-D5NA-881M50-P1A6QZ

SAYFP897MCA0B00R05

SFXG50PZ702

SAYFP836MAJ0F00

SAYRF1G95GE0F0A

DSX321G

FC-135, 9H03200031

1XTV19200FKA

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MT29C4G96MAZBACKD-5 WT

ESHS-2525UHRX-C81S

SC54412ACA

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SKY85703-11

RDA5802E

SKY77544-51

ACPM-5001

ACPM-9340-TR1

ACPM-9340-TR2

ACPM-9341-TR1

ACPM-9341-TR2

ACPF-8240

ACPM-1106

ACPM-924140

ACPM-5008

ACPF-7141

ACMD-4104

ACPM-5005

ACPM-9307

ACPM-9302

AJAV-5505

ACPM-7717

ACMD-6103

APDS-9960

ACPF-7124-TR1

ACPM-9041-TR2

ACPM-5401-TR1

ACPM-5402-TR1

ALM-1106

RF3237

EPS104A

EDS105SZ

CCH284

ERD116RS

EPG108A

1428 Rotary ERD110RSZ 0-9 (10-bit) Blue

Taiwan Yuanda DIP red dial switch 4-bit 2.54 NDS-04V key switch program toggle

EPS106A

EPS110AZ

CC6407

RXJ101M1CBK-0611

EDR201A0500, Taiwan ECE Reed Relay

EAH106EZ

ISO1050

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ERD416RSZ, 0-F 16-bit 4-to-1 coding switch, Taiwan ECE

ECE flat dial silver foot DIP switch EDS series

ECE flat dial gold foot DIP switch EDG series

ECE side dial key type gold foot switch EPG series

ECE side dial key type silver foot switch EPS series

Flat dial 90 degree bent foot EDGXXXSRA series

ECE Tri-State DIP Switch Series

ECE Narrow Body IC Type DIP Switch EAH Series

ECE narrow body IC type DIP switch EAM series

2.54MM SMD DIP switch EAD series

2.54MM SMD DIP Switch ESD Series

1.27MM SMD DIP Switch EHS Series

Slide Switch ESP Series

ESP1010

Introduction: Hongwang Semiconductor ICMAX announced the mass production of a single 8GB LPDDR4X, which is the first mass production in the industry. The mass production of LPDDR4X 8GB shows that the ICMAX product line is increasingly enriched and perfected, and now it provides comprehensive and advanced embedded storage products, providing higher performance for the new era of smartphones equipped with 8GB mobile DRAM and 512GB storage. The mobile phone market has caused a strong impact. The new storage solution has a higher storage capacity than most mobile phones, enabling users to fully experience the convenience of the era of large storage, without worrying about the mobile phone system reminding "insufficient storage space".

Today, China is cutting into its own power in various semiconductor fields, breaking foreign monopoly, including CPU microprocessors, NAND flash memory, OLED screen panels, etc., and DRAM memory is also time.

Chinese chip design company Zhaoyi Innovation recently issued an announcement, announcing that it signed the "Cooperation Agreement on Memory R&D Projects" with Hefei Industrial Investment Holding (Group) Co., Ltd. (Hefei Industrial Investment for short) on October 26.

The two parties agreed to cooperate in the research and development project of 300mm wafer (12 inches) and 19nm process memory, including DRAM memory particles, in the Economic and Technological Development Zone of Hefei City, Anhui Province.

In smartphones, in addition to the replacement of chips, the memory of mobile phones will also usher in new changes every year. ICMAX's upcoming LPDDR4X 8GB must be familiar to everyone, LPDDR (Low Power Double Data Rate), popularly said It is a low-power mobile memory, which is widely used in mobile electronic products such as mobile phones, tablets, smart rearview mirrors, vr, advertising players, and POS machines. On the mobile phone side, it is the operating memory (Ram) of the mobile phone. The memory on the PC side is usually referred to as DDR, so the principle of the two is the same, but the size and shape are different.

LPDDR4X is not the next-generation memory of LPDDR4, it can be regarded as a power-saving optimized version of LPDDR4. ICMAX LPDDR4X 8GB mobile memory provides a data transfer rate of 34.1GB per second while minimizing the increase in power consumption caused by increased DRAM capacity. Compared with LPDDR4, ICMAX LPDDR4X reduces power consumption by 10-20%, reduces the operating heat of the mobile phone, improves the battery life of the mobile phone, and has a longer standby time, which greatly improves the mobile phone experience. It is necessary to know that the power consumption of mobile phones needs to be reduced by 1%, and the performance optimization needs to invest several times. It is only by the pursuit of the ultimate that ICMAX has been able to cultivate for 15 years in the field of memory chips with very strict technical requirements, and continue to develop new products. , walk in the forefront of the industry.

Compared with LPDDR4, the memory frequency of LPDDR4X reaches 2133MHz, and the single-chip capacity of Hongwang Semiconductor ICMAX LPDDR4X reaches 8GB. Products with such specifications are rare in the industry, and it is even more rare that Hongwang Semiconductor has achieved mass production. We all know that the higher the LPDDR frequency, the faster the memory runs. The ICMAX LPDDR4X memory frequency reaches 2133MHz, and with the blessing of large capacity, the storage speed is more advantageous. It is very useful when running super-large games or recording 4K video. Obviously, the power consumption is lower, the operation is faster and the power consumption is less.

However, it should be noted that not all mobile phones can use LPDDR4X memory, which has certain requirements for mobile phone processors, so only some mid-to-high-end phones are equipped. For smartphone users, 8GB of DRAM enables app browsing on an extra-large, high-resolution screen for smoother multitasking and faster searches. Hongwang Semiconductor ICMAX is not only at the forefront of the industry in LPDDR4X, LPDDR5 is also in mass production planning,