XQ2V1000-4BG575H

Chip Details

Manufacturer Part Number:

XQ2V1000-4FG456N

Pbfree Code:

No

Rohs Code:

No

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

1 MM PITCH, MO-151AAJ-1, FBGA-456

Pin Count:

456

Reach Compliance Code:

not_compliant

ECCN Code:

3A001.A.2.C

HTS Code:

8542.39.00.01

Manufacturer:

Xilinx

Risk Rank:

8.79

Clock Frequency-Max:

650MHz

Combinatorial Delay of a CLB-Max:

0.44ns

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e0

Length:

23mm

Moisture Sensitivity Level:

3

Number of CLBs:

1280

Number of Equivalent Gates:

1000000

Number of Inputs:

324

Number of Logic Cells:

11520

Number of Outputs:

324

Number of Terminals:

456

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-55 °C

Organization:

1280 CLBS, 1000000 GATES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA456, 22X22, 40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

225

Power Supplies:

1.5, 1.5/3.3, 3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

2.6mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.575V

Supply Voltage-Min:

1.425V

Supply Voltage-Nom:

1.5V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

MILITARY

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Width:

23 mm

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