Shenzhen Meichuangxin Technology Zhongsheng 075588600196 18038076660 Original authentic electronic component chip agent

Guide: On August 13, according to Taiwan's "Electronic Times", citing sources, Foxconn plans to invest 60 billion to build an advanced packaging and testing plant in Qingdao and has broken ground recently.

Foxconn responded that the amount was inaccurate, and the specific information is subject to the official contract release news. After Foxconn responded, the media revised the amount of Foxconn's investment in the factory in the report that afternoon. According to revised reports, the investment in the plant is 1.5 billion yuan (about 200 million U.S. dollars).

Combined with the official default attitude, industry insiders believe that the fact that Foxconn has invested in the construction of an advanced packaging and testing plant in Qingdao can basically be confirmed. Moreover, it is also in line with Foxconn's business habits to start from packaging and testing with relatively low technology and capital investment, but the amount of investment in the project is The above is only different from previous reports.

At the same time, the outside world speculated that with Foxconn's vertical integration capabilities and years of experience in the electronics industry chain, as long as the conditions are mature, it is foreseeable to extend to the more profitable wafer manufacturing field in the future.

Coincidentally, on August 13, Foxconn (Hon Hai Precision) revealed that the company's semiconductor business achieved revenue of NT$70 billion (about 16.5 billion yuan) last year. Foxconn said that semiconductors will be one of the most important parts of the company's future growth momentum at the second-quarter earnings briefing held on the same day.

From this point of view, Foxconn's ambition to enter the semiconductor industry in the mainland and even become a large-scale semiconductor IDM manufacturer is very obvious.

In 2019, Foxconn's revenue in the semiconductor industry is composed of: 47% from equipment and process services, 34% from IC design, and 15% from packaging and testing. Overall, Foxconn itself already has a vertically integrated capability structure in the semiconductor industry.

Liu Yangwei, chairman of Foxconn, also said before that the group has laid out 3D packaging for semiconductors, and has also entered into panel level packaging (PLP) and deep cultivation of system level packaging (SiP). In terms of chip design, including 8K TV system single-chip integration, small chip applications, designing power chips, panel driver chips, and small control chips will all be the focus, and it is also expected to enter the field of image-related chip design.

In the 2019 Corporate Social Responsibility Report, Foxconn has clearly incorporated IC design and process design into the key research and development direction of new products in the future.

In addition, the construction of the factory in Qingdao is not the beginning of Foxconn's core-making plan. Back in 2017, Foxconn formed a semiconductor subgroup to develop its semiconductor business. In the past two years, Foxconn has reached a number of agreements with cities such as Zhuhai, Jinan and Nanjing to participate in local chip manufacturing.

The specific industrial chain layout and scale, we are waiting for the official announcement. However, from the king of consumer electronics foundry to chip manufacturing, can Foxconn's cross-border entry bring the "catfish effect" of mainland semiconductors?