SI2305CDS-T1-GE3 -8 V 5.0 A 35 Mohm Drain Source On Resistance 12 nC Qg at 4.5 V SOT-23

SI2305CDS-T1-GE3 product detailed specifications

Standard package 3,000

FET Type MOSFET P-Channel, Metal Oxide

FET FeaturesLogic Level Gate

Drain-to-source voltage (VDSS) 8V

Current - Continuous Drain (No.) @ 25°C 5.8A

Rds (max) @ ID, VGS35 mOhm @ 4.4A, 4.5V

VGS (TH) (max) @ Id1V @ 250µA

Gate Charge (Qg) @ VGS30nC @ 8V

Input Capacitor (Ciss) @ 960pF of Vds @ 4V

Power - 1.7W max

Mounting Type Surface Mount

Bag/Box TO-236-3, SC-59, SOT-23-3

Supplier Device Package SOT-23-3 (TO-236)

Packaging Tape & Reel (TR)

Packaging 3SOT-23

channel type P

Channel Mode Enhancement

Maximum drain-source voltage 8 V

Maximum continuous drain current 4.4 A

RDS - at 35@4.5V mOhm

Maximum gate-source voltage ±8 V

Typical turn-on delay time 20 ns

Typical turn-off delay time 40 ns

Typical fall time 10 ns

Operating temperature -55 to 150 °C

Install the Surface Mount

Standard Packaging Tape & Reel

Maximum gate-source voltage ±8

Packing width 1.4(Max)

PCB3

Maximum Power Dissipation 960

Maximum drain-source voltage8

EU RoHS Directive Compliant

Maximum drain-source resistance 35@4.5V

Number of components per chip 1

Minimum operating temperature -55

Supplier Package SOT-23

Standard package name SOT-23

Maximum working temperature 150

Packing length 3.04(Max)

Number of pins 3

Packaging height 1.02(Max)

Maximum continuous drain current 4.4

Package Tape and_Reel

Lead Shape Gull-wing

P(TOT) 1.25W

Match code SI2305CDS-T1-GE3

Unit pack 3000

Standard lead time 15 weeks

MOQ 3000

Polarized P-CHANNEL

Lead-free DefinRoHS-conform

I (D) 3.5A

V(DS)8V

R (on DS) 0.052Ohm

FET FeaturesLogic Level Gate

Mounting Type Surface Mount

Current - Continuous Drain (Id ) @ 25 °C 4.4A (Ta), 5.8A (Tc)

Vgs(th) (max) @ Id1V @ 250µA

Drain to source voltage (Vdss) 8V

Supplier Equipment Package SOT-23-3 (TO-236)

On-state Rds (max) @ Id, V GS35 mOhm @ 4.4A, 4.5V

FET Type MOSFET P-Channel, Metal Oxide

Power - 1.7W max

Package/Enclosure TO-236-3, SC-59, SOT-23-3

Input Capacitor (Ciss) @ VDS960pF @ 4V

Gate Charge (Qg) @ VGS30nC @ 8V

RoHS Directive Lead free / RoHS Compliant

Other namesSI2305CDS-T1-GE3CT

CategoryPower MOSFET

Configure Single

Dimensions 3.04 x 1.4 x 1.02mm

Height 1.02mm

Length 3.04mm

Maximum drain-source resistance 0.035 Ω

Maximum operating temperature +150 °C

Maximum power dissipation 0.96 W

Minimum operating temperature -55 °C

Packaging Type SOT-23

Typical Gate Charge @ VGS12 nC V @ 4.5, 20 nC V @ 8

Typical Input Capacitance @ VDS960 pF V @ 4

Width 1.4mm

Factory packing quantity 3000

Product TypeMOSFET

Transistor Polarity P-Channel

Source breakdown voltage +/- 8 V

Continuous drain current 4.4 A

Installation style SMD/SMT

RDS(ON) 35 mOhms at 4.5 V

Power dissipation 960 mW

Part Number Alias SI2305CDS-GE3

Rise time 20 ns

Drain-source breakdown voltage 8 V

RoHSRoHS Compliant

Fall time 20 ns

Gate-source voltage (max) ~8 V

Drain-source on-resistance 0.035 ohm

Operating temperature range -55C to 150C

Polarity P

Type Power MOSFET

Number of components 1

Operating temperature classification Military

Drain-source turn-on voltage 8 V

Arc hardeningNo

Remove Compliant

Continuous Drain Current Id:-5.8A

Drain Source Voltage Vds:-8V

On Resistance Rds(on): 28mohm

Rds(on) Test Voltage Vgs:-4.5V

Threshold Voltage Vgs:-400mV

Power consumption: 960mW

Operating Temperature Min:-55°C

Operating Temperature Max: 150°C

Transistor Case Style: SOT-23

No. of Pins: 3

MSL:-

Current Id Max:-5.8A

Operating temperature range: -55°C to +150°C

Ordinary Bluetooth audio devices can only achieve 1-to-1 connection, including ordinary wireless Bluetooth headsets. However, there is no wire connection between the two earbuds of the TWS headset, and a 1-to-2 connection is required when connecting to a mobile phone.

Apple AirPods adopts Snoop monitoring mode, that is, listening to the left and right ears together, and Apple has implemented a patent block on the monitoring mode. In the early days, other TWS mainly used the relay forwarding mode, and the audio was transmitted from the mobile phone to the left ear (master device), and then forwarded from the left ear to the right ear (slave device).

The forwarding technology can be divided into traditional 2.4G forwarding, NXP's NFMI near-field magnetic communication technology and Hengxuan's LBRT low-frequency forwarding technology.

Compared with Apple's listening mode, the forwarding mode has the following disadvantages:

1) Due to the process of forwarding to the right ear (slave device) through the left ear (master device), the stability and delay of the connection in the forwarding mode are much worse than Apple's monitoring mode;

2) The monitor mode can be used in any single ear, while the forward mode is only used for the left ear (main device);

3) The power consumption of the left ear (master device) is significantly higher than that of the right ear (slave device).

Bluetooth 5.0 does not improve forwarding mode performance. Bluetooth has long supported connecting multiple terminals, but does not support simultaneous audio playback. That is to say, ordinary Bluetooth 5.0 technology does not support the function of TWS headset 1-to-2 connection to play music at the same time, but can only rely on monitoring technology or forwarding technology, etc., because the audio data transmission uses the traditional Bluetooth mentioned above. standard, not BLE Bluetooth Low Energy.

Therefore, even if Bluetooth is upgraded from 4.2 to Bluetooth 5.0, the disadvantage of forwarding mode compared to listening mode still exists, and the connection stability and delay of other manufacturers' TWS headphones are still worse than Apple's AirPods.

Bluetooth 5.0 can transmit commands more smoothly. Although Bluetooth 5.0 does not upgrade audio transmission, Bluetooth 5.0 provides higher bandwidth for low-power Bluetooth BLE. The PHY has evolved from 1M to 2M in Bluetooth 4.X, enabling Bluetooth devices to transmit commands more smoothly. For example, AirPods2 can support Siri.

MTK Luoda launched the AB1532 chip equipped with a new generation of TWS technology (MCSync, Multi Cast Synchronization) in early 2019. MCSync has the advantages of more stable connection, less staccato sound, support for high-resolution audio stream, low latency, more balanced power consumption for both ears, and suitable for various mobile phone platforms. In addition, MCSync also supports Multiple speakers connection.

In mid-2019, Luoda launched a more mature AB1536 chip, whose comprehensive experience such as connection performance was on par with Apple's AirPods, and became a popular chip.

In July 2019, the Luoda AB155X platform series cooperated with Sony to launch the Sony WF-1000XM3 product, which features Active Noise Cancellation (ANC) and supports Google Bisto.

In February 2018, Qualcomm launched TWS+ (TrueWireless Stereo Plus) technology. According to its official website, TWS+ is a Qualcomm-to-Qualcomm connection technology that can only be implemented between TWS headsets using Qualcomm QCC5100/QCC30XX Bluetooth chips and mobile phones based on Snapdragon 845, 670, and 710 mobile platforms.

Under the TWS+ connection technology, there will be two independent audio streams directly transmitted from the mobile phone to two different headphones, that is, the left and right channels are connected independently. If it is detected that the phone does not support TWS+ technology during the communication between the headset and the mobile phone, the headset will automatically switch to the TWS universal mode that is compatible with almost all smartphones.

Qualcomm TWS+ technology has been launched for more than a year, but the promotion speed is slow. Since TWS+ technology actually exceeds the existing Bluetooth standard, it needs to be implemented by optimizing the Bluetooth standard or the Android system. Crazy rice FUNCL AI, OPPO O-Free, bird track air, Edifier TWS5 and other products use Qualcomm QCC30XX chip, but they all castrated the TWS+ function.

In September 2019, vivo's TWS Earphone true wireless Bluetooth headset is the first in the industry to be equipped with Qualcomm's flagship QCC5126 solution, and mobile phones equipped with chips above Snapdragon 855 can open the TWS Plus connection mode (currently supported models are NEX 3, NEX 3 5G, iQOO Pro, iQOO Pro 5G, Z5).

The 1more stylish released in April 2019 also castrated the TWS+ function, but the latest 1more TWS+ will start shipping on November 15, and the TWS+ function can be implemented for mobile phones with chips above Snapdragon 855.

We believe that with the launch of vivo's TWS Earphone and 1more's latest TWS earphones, it shows that Qualcomm's TWS+ technology has matured, and the Q to Q ecosystem is truly launched.

In the past, Huawei FreeBuds, FreeBuds 2 Pro, and Honor FlyPods all used Hengxuan's forwarding scheme.

In September 2019, the FreeBuds 3 released by Huawei adopted Huawei's self-developed Kirin A1 chip and self-developed dual-channel synchronous transmission technology, which can realize the left and right earphones respectively obtain the left and right channel signals from the mobile phone (similar to Qualcomm's TWS+ technology). ) for more efficient transmission and lower power consumption.

Under the same interference intensity, the anti-interference performance of Kirin A1 and Apple H1 is basically the same as that of H1, which is much higher than other chip solutions in the market; in terms of transmission rate, the theoretical transmission rate of Kirin A1 chip reaches 6.5Mbps, three times higher than Other chips; when connecting audio, the transfer rate of lossless audio reaches 2.3Mbps. In addition, FreeBuds 3 is equipped with an independent Audio DSP processing unit, and the delay is reduced to 190ms, which is 30ms less than the 220ms of AirPods.

We believe that Huawei's self-developed Kirin A1 chip is similar to Apple's self-developed H1 chip, indicating that Huawei's positioning of TWS+ headphones has reached a new level. Through the adaptation of the self-developed Kirin A1 chip and its own mobile phone Kirin SOC platform, Huawei will also establish its own FreeBuds 3 headset-Huawei mobile phone connection ecology, which will achieve or even surpass the AirPods-iPhone ecology.

Both Qualcomm TWS+ and Huawei FreeBuds 3 break through the existing Bluetooth 5 technology and realize left and right dual-channel transmission, which is an optimization and upgrade of the existing Bluetooth 5 technology.

If Qualcomm TWS+ and Huawei's Bluetooth technology are expected to become the standard of the next-generation Bluetooth technology Bluetooth 6, that is, the Bluetooth 6 standard itself supports left and right dual-channel transmission, or it may lead to the disappearance of the meaning of Apple's monitoring mode technology blocking, rather than the penetration rate of Apple's TWS headset Or it will be greatly accelerated, and at the same time lead to changes in the competitive landscape of Bluetooth chips.

Of course, the formation of standards is not an easy task, but a very long and cumbersome matter, which also involves games between multiple manufacturers; even after the formation of standards, the promotion and application of standards will take time.

How popular are TWS headphones? Perhaps the Huaqiangbei market is the most sensitive. At present, Huaqiangbei white-brand TWS headphones are popular, and even a bit recreates the era of "cottage phones" around 2010.

According to the introduction of some white-brand TWS earphone products on the Tmall APP, we found that the white-brand TWS can basically realize most of the functions of AirPods. We searched on Pinduoduo and Tmall APP and found that the price of Huaqiangbei white TWS earphones is around 100-300 yuan, the first place on Pinduoduo sells more than 5,000 pieces, and a certain product on Tmall sells more than 3,000 pieces per month. .

From the perspective of shipments, according to Counterpoint data, AirPods shipments accounted for about half of all TWS headset shipments in 2019Q1, that is, the ratio of Android TWS to AirPods shipments is about 1:1. According to Gartner data, the global smartphone shipments in 2018 were about 1.4 billion, of which Apple accounted for about 200 million, that is, the ratio of Android mobile phones to Apple mobile phone shipments was about 6:1. Considering that TWS earphones are mainly used with smartphones, replacing traditional wired earphones, it may even become the standard configuration of smartphones. Therefore, we can reasonably deduce that in the next few years, the annual sales of Android TWS is expected to reach 6 times that of AirPods.

As we mentioned above, the current TWS industry competition pattern is dominated by Apple, other mobile phone, traditional audio, and accessory manufacturers contend, and white-label TWS headphones are prevalent.

Referring to the development history of cottage machines, we believe that the competitive landscape of the TWS industry will go through the following processes:

1) Apple AirPods create new products, and high-end users begin to use them;

2) Low-priced white-brand TWS earphones encourage consumers to try and experience TWS earphones, which is conducive to opening up the market demand of the TWS industry;

3) Brand manufacturers rely on product quality and brand advantages to make the TWS headset industry concentrate on brand manufacturers;

4) Mobile phone brand manufacturers rely on the ecosystem formed by TWS earphones and smartphones to bring a better experience, making the TWS earphone industry further concentrate on mobile phone brand manufacturers.

Therefore, in the long run, we believe that TWS headsets from mobile phone brand manufacturers such as Apple, Huawei, Samsung, OPPO, vivo, and Xiaomi will occupy the main market. Behind the brand manufacturers is the competitive landscape of Bluetooth solutions. Apple uses self-developed Bluetooth chips; Huawei also uses self-developed Bluetooth chips; Samsung may also develop self-developed Bluetooth chips in the future; OPPO, vivo, and Xiaomi should mainly use Qualcomm's Bluetooth chips. Bluetooth chip to achieve adaptation with Qualcomm Snapdragon platform.

AD8505ARJZ AD8532ARZ-REEL7 AD8534ARZ-REEL AD8541ARTZ-REEL7 AD8542ARZ-REEL7 AD8544ARUZ AD8544ARZ AD8613AUJZ AD8617ARZ-REEL7 AD8692ARZ-REEL7 AD8694ARZ-REEL7 ADA4505-1ARJZ

On September 22, the 2019 Biometrics Technology and Application Summit Forum sponsored by Core Intelligence officially kicked off in Shenzhen Kexing Science Park. With the rapid development of industries such as smart phones, mobile payment, smart security and smart home, biometric technologies such as fingerprint recognition, face recognition, and voice recognition are ushering in good opportunities for development. Widely used in major commercial, government and enterprise, consumer markets. Nowadays, with the improvement of application requirements, the market has put forward higher requirements for the security, recognition speed, accuracy, and cost of biometric technology.

With the theme of "Integration and Innovation", this summit forum invited well-known enterprises and technical experts in the fields of face recognition, voice (voiceprint) recognition, fingerprint recognition, eye tracking, iris recognition and many other biometric technologies, including the Chinese Academy of Sciences. Qiao Yu, Director of Digital Institute of Shenzhen Institute of Advanced Technology, Chen Wei, Researcher of Integration Institute of Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Dr. Zhang Weibin, Chief Scientist of Shengyang Technology, He Huogao, China Sales Director of Intel RealSense Product Division, Qixin Yiwei Mobile Phone Kong Xianghui, Product Director of the Business Department, Dai Qiqiang, Deputy General Manager of Xiaoyou Intelligent Technology, Cai Bo, Sales President of Canaan Technology, Chen Hua, Commercial Director of Zhongke Hongba Mobile Business, and Sun Yungang, Senior Product Manager of Siliwei, jointly promote the new technology of biometric identification The communication and implementation of the conference will discuss the future development direction of biometric technology.

Hong Kong Xinrui Electronics Co., Ltd., 18 years of professional component distributors (authorized and non-authorized brands), one-stop terminal manufacturer support: (quality assurance and integrity management) is the company's commitment to provide customers with brand original semiconductors, electronic components Terminal supporting market, focusing on ESD/TVS electrostatic protection diodes, LDO low-power voltage regulators, MOS tubes, battery charging and management power supplies, LEDs, optocouplers, resistors and capacitors, PCB solutions (wireless Bluetooth solutions, Bluetooth sports version solution one-stop, speakers, wireless power bank).

Main products: ESD electrostatic diodes, TVS diodes, battery charging and management power supplies, MOS tubes, LDO low-power voltage regulators.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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For more models, please inquire:

Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com

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Hong Kong Xinrui Electronics Co., Ltd. is a professional supplier of integrated circuits and has many years of sales experience in the bank! With a large stock of stock, integrity-based, customer first, the quality of products for customers!

Due to the large number of company models, it is impossible to upload them one by one. If you can't find the product you want on the website, please contact the salesperson. Our company can provide electronic components distribution service.

Company: Hong Kong Xinrui Electronics Co., Ltd.

Contact: Miss Yao

Mobile: 13725590222

Tel: 0755-83780666/83265111

Fax: 0755-82800889

QQ: 3373563833

Address: 26B, Block B, Huaqiang Plaza, Futian North Road, Futian District, Shenzhen

Company website: www.xrdz-hk.com The fastest shipping speed ever.