-
2022-09-24 14:42:51
XA Spartan-3
XA Spartan-3_XC6VLX365T-2FF1156I Introduction
Lowering the temperature also increases the reliability of the chip exponentially. Lowering the temperature by 20°C can reduce leakage power consumption by more than 25%. Voltage and temperature control As shown in Figure 1, reducing both voltage and temperature can significantly reduce leakage current. By changing the power supply configuration, it is easy to adjust the supply voltage. Current FPGAs do not support wide-range voltage scaling, and the recommended voltage range is typically ±5%. Junction temperature can be reduced with cooling schemes such as heat sinks and airflow. Studies have shown that a 20°C reduction in temperature can increase the overall life of the chip by a factor of 10. A 5% reduction in supply voltage can reduce power consumption by 10%.
Victor Peng pointed out that the first strategy is "data center first." In the data center space, it is important to realize that Xilinx can support not only compute acceleration and data center applications, but also value-creating storage and networking. In order to better adapt to the new world of intelligent interconnection, Xilinx continues to take "flexible platform" as the core of its products, seizes new industrial opportunities, and formulates three major development strategies to support wider market applications.
XA Spartan-3_XC6VLX365T-2FF1156I
XC6VLX75T-1FF484I
Today, Xilinx's rich and powerful platform supports 70% of new developments, leading the way in FPGA-based system design. Softnautics chose Xilinx technology to implement this solution because it integrates both the Vitis™ AI stack and powerful hardware capabilities.
As human language writing forms have evolved, thousands of unique character systems have developed. Plus case (uppercase/lowercase/full small/small case), italic (Italian/Roman), scale (horizontal scale), weight, specified size (display/text), squiggly, serif (Generally divided into serifs and sans-serifs), this number can scale to millions, making text recognition an exciting professional discipline in the field of machine learning.
If AMD reaches an acquisition agreement with Xilinx, the value of semiconductor M&A transactions in 2020 may also rise to $93.1 billion, making it the third largest merger and acquisition year in the history of the semiconductor industry. In fact, 2020 was supposed to be a sluggish year for mergers and acquisitions in the semiconductor market, affected by the new crown epidemic and Sino-US relations. These two transactions have made the global semiconductor landscape go through a new round of mergers and acquisitions and reshuffles. According to the report data released by IC Insights, a third-party analysis agency on September 29, the total value of global semiconductor mergers and acquisitions soared to US$63.1 billion in the first nine months of 2020, of which the two transactions of Nvidia-Arm and ADI-Maxim accounted for about 97% of total M&A in 2020. In the first quarter of this year, the value of semiconductor M&A transactions was $1.8 billion, and it only reached $165 million in the second quarter. However, in the third quarter, the demand for the semiconductor market has recovered significantly, and the cost expenditure has increased, and a new wave of mergers and acquisitions has emerged.
AMD’s stock price has soared 89% this year, and its market value has now exceeded $100 billion to $101.568 billion. In response to AMD's acquisition of Xilinx, the Wall Street Journal analyzed that AMD may use its high stock valuation as a bargaining chip to promote the transaction or delist Xilinx at a high price.
XA Spartan-3_XC6VLX365T-2FF1156I
XC5VLX50-3FFG324C
XC4VLX25-11SF363C XC4VLX25-11FF668I XC4VLX25-11SFG363C XC4VLX25-11FFG668I XC4VLX25-11FF668C XC4VLX160-10FFG1148I XC4VLX160-10FF1513C XC4VLX15-11FFG668I XC4VLX160-10FFG1148C XC4VLX160-10FF1148I XC4VLX15-12SF363C XC4VLX160-10FF1513I XC4VLX160-10FF1148C XC4VLX15-12FFG668C XC4VLX15-11SFG363C XC4VLX160-11FFG1513C XC4VLX15- 12FF668C XC4VLX15-11SF363I XC4VLX15-11FFG668C.
XC4VLX200-11FFG1513C XC4VLX200-11FFG1513I XC4VLX200-12FF1513C XC4VLX200-12FFG1513C XC4VLX200-10FFG1513C XC4VLX200-10FFG1513I XC4VLX200-11FF1513C XC4VLX40-10FF1148I XC4VLX25-11FFG668C XC4VLX40-10FF668I XC4VLX40-10FF1148C XC4VLX25-12FFG668C XC4VLX40-10FF668C XC4VLX25-12SFG363C XC4VLX25-12FF668C XC4VLX25-11SF363I XC4VLX60- 10FF1148I XC4VLX25-11SFG363I.
XC6VLX240T-1FFG784I XC6VLX240T-2FF1156C XC6VLX365T-1FFG1759C XC6VLX240T-1FFG784C XC6VLX240T-3FF784C XC6VLX240T-3FFG784C XC6VLX365T-1FF1759C XC6VLX240T-3FFG1156C XC6VLX365T-2FF1156C XC6VLX365T-2FF1759I XC6VLX240T-3FFG1759C XC6VLX365T-2FF1156I XC6VLX550T-1FFG1760I XC6VLX550T-2FF1760C XC6VLX550T-2FF1759I XC6VLX550T-1FFG1759C XC6VLX365T- 1FF1759I XC6VLX365T-1FF1156C XC6VLX365T-1FF1156I XC6VLX550T-2FF1759C.
XC5VLX50T-3FF1136C XC5VLX50T-3FFG665C XC5VLX50-3FF1153C XC5VLX50-2FFG676I XC5VLX50-2FFG676C XC5VLX50-2FFG324I XC5VLX50-3FFG324C XC5VLX50-3FFG1153C XC5VLX50-3FF676C XC5VLX50-3FF324C XC5VLX50T-1FF665C XC5VLX50T-1FF1136I XC5VLX50T-1FF1136C XC5VLX50-3FFG676C XC5VLX330T-1FFG1738I XC5VLX330T-2FFG1738C XC5VLX330T- 1FF1738I XC5VLX330T-1FFG1738C.
XA Spartan-3_XC6VLX365T-2FF1156I
Especially in the era of artificial intelligence, Xilinx also hopes to realize the future of Intel and Nvidia through this advantage. However, at 7nm, FPGA speed and density are greatly increased, and power consumption is also lower, so this competitive landscape may change, especially for ASICs and FPGAs. The competition between FPGAs and ASICs will continue. Split the SoC prototyping and emulation market. Flexibility and adaptability are the main selling points of ACAP. The introduction of ACAP will help Xilinx compete with higher-level competitors in new markets. Apparently this applies to Intel and Nvidia. Intel's 10nm is still delayed, allowing Xilinx to dominate the FPGA market after acquiring Altera, in addition to the cloud market that Intel is focusing on.
This is an adaptive computing acceleration platform. At present, the main series of FPGA products include high-performance virtex series, mid-range kintex series and low-cost artix and spartan series. In fact, in 2014, Xilinx began work on a new generation of products that debuted in early 2018. Cyrus defines it as a new product different from CPU, GPU and FPGA. In July 2016, Xilinx said it would become an all-programmable company within the next five years, using its strengths to help customers differentiate and target emerging areas such as cloud computing, Internet of Things, 5G wireless and embedded vision.
