XC6VLX195T-1FF784I_XC6VLX240T-1FFG1759C Introduction

As an FPGA (Field Programmable Gate Array)-based company, Xilinx's strategy lies in three aspects: "data center priority", "accelerating the development of the core market" and "driving adaptive computing". This year, it has successively released the integrated SmartNIC platform AlveoU25, the strongest 7nm cloud chip Versal Premium, and an innovative TCON (Timing Controller, timing controller) solution for FPGA devices.

Since the birth of video recording, restoring every inch of the realistic world has always been the ultimate pursuit of the industry. However, in fact, the human eye itself is a "miracle creation". It can perceive every light and dark part between a square inch through the enlargement and reduction of the pupil, while the real world follows the natural illumination and has different details of the light and dark parts. . The five factors that affect image quality include resolution, bit depth, frame rate, color gamut, and brightness. In recent years, 4K/8K 60Hz/120Hz display panels have gradually become familiar to everyone. Domain and brightness are also put forward new requirements.

XC6VLX195T-1FF784I_XC6VLX240T-1FFG1759C

XC5VLX85T-2FFG1136C

Since AMD launched the Ryzen 4000 series notebook platform APU processors at CES in January this year, in order to facilitate consumers to identify and search, the Zen 3 architecture processor series was directly named the 5000 series. A total of 4 CPUs were released this time, namely Ryzen9 5950X, Ryzen9 5900X, Ryzen7 5800X and Ryzen5 5600X.

Among the four products, the flagship processor is the Ryzen 9 5950X, which is the same as the Ryzen 9 3950X, with dual CCD modules, 16 cores and 32 threads, 8MB L2 cache, and 64MB L3 cache, of which the L3 cache is from four 16MB blocks. It has become two pieces of 32MB, which are shared by 8 cores respectively. The maximum acceleration frequency has increased from 4.7GHz to 4.9GHz, and the base frequency is 3.4GHz.

However, with opportunities come challenges. AI inference, the process of using trained machine learning algorithms to make predictions, whether deployed in the cloud, edge, or on-device, requires excellent processing performance within a tight power budget. The prevailing view is that this requirement cannot be met by CPUs alone, and that some form of computational acceleration is needed to handle AI inference workloads more efficiently.

Xilinx once revealed to the media that because Intel acquired Altera, many potential customers will hand over more orders to Xilinx for the sake of neutrality, so Xilinx's share in the FPGA market has increased significantly in the past two years. Some industry analysts pointed out that if AMD succeeds in winning Xilinx, it will bring a new competitive landscape to the global semiconductor industry. Like the outside world's neutral view of Arm, once AMD successfully acquires Xilinx, downstream customers will only have two choices when purchasing FPGA chips and related solutions, which will increase the concerns of downstream companies.

XC6VLX195T-1FF784I_XC6VLX240T-1FFG1759C

XC5VLX85-2FF1153I

XC6VLX130T-1FFG784C XC6VLX130T-1FFG784I XC6VLX130T-1FF484C XC5VSX95T-3FF1136C XC5VSX95T-2FFG1136I XC5VTX240T-1FF1759C XC5VTX240T-3FF1759C XC5VTX240T-3FFG1759C XC6VLX130T-1FF1156C XC6VLX130T-1FF1156I XC5VTX240T-2FF1759C XC5VTX240T-1FF1759I XC5VTX240T-1FFG1759C XC5VSX95T-3FFG1136C XC5VSX95T-1FFG1136C XC5VSX50T-3FFG665C XC5VSX95T- 1FF1136C XC5VTX240T-1FFG1759I XC5VSX95T-2FFG1136C XC5VSX95T-1FFG1136I XC5VSX95T-2FF1136C XC5VSX95T-1FF1136I XC5VSX50T-2FF665C XC5VSX50T-2FFG665C XC5VSX50T-2FFG1136I XC5VSX95T-2FF1136I XC5VSX50T-3FFG1136C XC5VSX50T-2FFG665I XC5VSX50T-2FFG1136C XC5VSX50T-3FF665C XC5VSX50T-1FFG1136C XC5VSX50T-1FF1136I XC5VSX50T-3FF1136C XC5VSX50T -1FF665I XC5VSX50T-2FF1136C XC5VSX50T-1FFG1136I XC5VSX50T-1FF665C XC5VSX50T-1FFG665I XC5VSX35T-2FF665I XC5VSX35T-2FF665C .

XC6VLX240T-1FF784I XC6VLX195T-2FF1156I XC6VLX195T-2FF1156C XC6VLX195T-2FF784I XC6VLX195T-2FF784C XC6VLX130T-3FF1156C XC6VLX130T-2FFG484C XC6VLX195T-3FFG1156C XC6VLX130T-2FFG784I XC6VLX240T-1FF1156C XC6VLX195T-3FFG784C XC6VLX240T-1FF1759C XC6VLX240T-1FF1156I XC6VLX195T-1FF784C XC6VLX130T-2FF784I XC6VLX130T-3FFG784C XC6VLX195T- 1FF784I XC6VLX130T-2FFG1156C XC6VLX130T-2FFG784C XC6VLX130T-2FF484I XC6VLX130T-2FFG1156I XC6VLX130T-1FF484I XC6VLX130T-3FF784C XC6VLX130T-1FFG1156I .

XC6VLX130T-1FFG1156C XC6VLX130T-3FFG1156C XC6VLX195T-1FF1156C XC6VLX130T-3FF484C XC6VLX130T-3FFG484C XC6VLX130T-2FF484C XC5VTX240T-2FF1759I XC5VTX240T-2FFG1759C XC5VTX240T-2FFG1759I XC6VLX130T-1FFG484C XC6VLX130T-1FFG484I XC6VLX130T-1FFG784C XC6VLX130T-1FFG784I XC6VLX130T-1FF484C XC5VSX95T-3FF1136C XC5VSX95T-2FFG1136I XC5VTX240T- 1FF1759C XC5VTX240T-3FF1759C XC5VTX240T-3FFG1759C XC6VLX130T-1FF1156C XC6VLX130T-1FF1156I.

XC7K410T-2FFG900I XC7K410T-2FFG900C XC7K410T-2FFG676I XC7K410T-1FFG900I XC7K480T-1FFG1156I XC6VLX550T-3FFG1760C XC6VLX75T-1FFG784C XC6VLX75T-1FFG484I XC6VLX75T-1FFG484C XC6VLX75T-1FF784I XC6VLX365T-3FF1759C XC6VLX365T-3FFG1156C XC6VLX365T-2FFG1156C XC6VLX550T-2FF1760I XC6VLX550T-3FFG1759C XC6VLX550T-3FF1760C XC6VLX550T- 3FF1759C XC6VLX550T-2FFG1760I.

XC6VLX195T-1FF784I_XC6VLX240T-1FFG1759C

As current chip manufacturing processes become more complex and chip designs become more complex, initial costs for chip design manufacturers have skyrocketed, and the risks of tape have further increased. This is equivalent to the successful promotion of Xilinx, and will have higher competition with companies such as Intel and Nvidia. Against competitors like Intel and NVIDIA, you should focus on Xilinx's core competency, which is at the hardware level, it can be flexible and adaptable according to different workloads and forces, rather than traditional domain and competition. As a larger competitor, Altera has joined Intel in 2015, and Xilinx's new competitors have become Intel, NVIDIA and others. The need to reduce the cost of chips, reduce the risk of shooting, and shorten the time to market will further erupt.

The I/O and clock circuits account for 1/3 of the total active power consumption, and the power consumption can be even higher if high-power I/O standards are used. According to the report, active power consumption is the power consumption when the design is active at high temperature, including dynamic and static power consumption. It's no surprise that the CLB accounts for the largest portion of active and standby power, but other modules also generate considerable power. Standby power is the power consumption when the design is idle and consists of static power consumption at rated temperature. Figure 2 shows an exploded view of the active and standby power consumption of the XC3S1000.