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Chip Details

Manufacturer Part Number: H5TC2G63FFR-PBA

Rohs code: yes

Ihs Manufacturer: SK Hynix Co., Ltd.

Parts Package Code: BGA

Packing Instructions: TFBGA, BGA96, 9X16, 32

Number of pins: 96

Achieving Compliance Code: Compliant

ECCN code: EAR99

HTS code: 8542.32.00.36

Manufacturer: SK hynix

Risk Level: 5.63

Access Mode: Multi-Bank Page Burst

Maximum access time: 0.225 nanoseconds

Clock maximum frequency (fCLK): 800 MHz

I/O Type: Common

Interleaved burst length: 4, 8

JESD-30 code: R-PBGA-B96

Length: 13mm

Memory density: 2147483648 bits

Memory IC Type: DDR DRAM

Memory Width: 16

Number of functions: 1

Number of ports: 1

Number of terminals: 96

Word count: 134217728 words

Word count code: 128000000

Operating Mode: Synchronous

Maximum operating temperature: 85°C

Organization: 128MX16

Output characteristics: three-state

Package Equivalent Code: BGA96, 9X16, 32

Packaging shape: rectangle

Packaging: Grid, Thin Profile, Fine Pitch

Peak Reflow Temperature (Cel): Not Specified

Power: 1.35 volts

Eligibility Status: Unqualified

Refresh cycle: 8192

Maximum height in sitting position: 1.2mm

Continuous burst length: 4, 8

Standby Current Maximum: 0.012A

Subcategory: Memory

Maximum supply current: 0.205 mA

Maximum supply voltage (Vsup): 1.45 volts

Minimum supply voltage (Vsup): 1.283 volts

Power supply voltage nominal (Vsup): 1.35 volts

Surface Mount: Yes

Technology: CMOS

Temperature class: other

Terminal Form: Ball

Terminal pitch: 0.8mm

End position: bottom

Width: 7.5mm

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