Brand_Name Texas Instruments

Whether Rohs certification meets

Lifecycle Obsolete

IHS Manufacturer TEXAS INSTRUMENTS INC

Parts Package Code BGA

Package DescriptionVFBGA, BGA113, 12X12, 20

113 needles

Reach Compliance Code compliant

HTS code 8542.31.00.01

Factory Lead Time 1 week

Risk level 5.74

Has ADC YES

Other FeaturesALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 3MHZ

address bus width

Bit size 16

Boundary Scan YES

CPU series MSP430

Maximum clock frequency 8 MHz

DAC channel YES

DMA channel YES

External data bus width

Format FIXED POINT

Integrated cache NO

JESD-30 Code S-PBGA-B113

JESD-609 code e1

length 7 mm

Low power mode YES

Moisture Sensitivity Level 3

Number of DMA channels3

Number of external interrupt devices

Number of I/O lines 80

Serial I/O number 2

Number of terminals 113

Number of timers 11

On-chip data RAM width 8

On-chip program ROM width 8

Maximum operating temperature 85 °C

Minimum operating temperature -40 °C

PWM channel YES

Package body material PLASTIC/EPOXY

Package code VFBGA

Package Equivalent Code BGA113, 12X12, 20

Package shape SQUARE

Package GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Celsius) 260

Power 2/3.3 V

Certification StatusNot Qualified

RAM (bytes) 8192

RAM (number of words) 8

ROM (word) 118784

ROM Programmable FLASH

Maximum seat height 1 mm

Speed 8 MHz

Subcategory Microcontrollers

0.74 mA maximum slew rate

Maximum supply voltage 3.6 V

Minimum supply voltage 2.7 V

Nominal supply voltage 3 V

Surface MountYES

Technology CMOS

Temperature class INDUSTRIAL

Terminal Surface Tin/Silver/Copper (Sn/Ag/Cu)

Terminal form BALL

Terminal pitch 0.5 mm

Terminal position BOTTOM

Maximum time NOT SPECIFIED at peak reflow temperature

width 7 mm

uPs/uCs/peripheral IC type MICROCONTROLLER, RISC