Packaging: Tape and Reel (TR)

Part Status: Active

Transistor Type: NPN

Vce saturation voltage drop at different Ib, Ic (maximum): 400mV @ 5mA, 50mA

Current - Collector Cutoff (Max): 100nA (ICBO)

DC current gain (hFE) (minimum) at different Ic, Vce: 100 @ 10mA, 1V

Operating temperature: 150°C (TJ)

Mounting Type: Surface Mount

Package/Enclosure: TO-236-3, SC-59, SOT-23-3

Supplier Device Package: SOT-23

Current - Collector (Ic) (max): 1.5 A

Voltage - Collector Emitter Breakdown (max): 25 V

Power - Maximum: 300 mW

Changdian Technology is the world's leading provider of semiconductor microsystem integration and packaging and testing services, providing a full range of one-stop services for microsystem integration, including integrated circuit system integration packaging design, technology development, product certification, in-wafer testing, Wafer-level mid-pass packaging and testing, system-in-package testing, finished chip testing and direct shipment to semiconductor suppliers around the world.

Through highly integrated wafer-level WLP, 2.5D/3D, system-in-level (SiP) packaging technology and high-performance Flip Chip and lead interconnect packaging technology, Changdian Technology's products and technologies cover mainstream integrated circuit system applications, including Network communications, mobile terminals, high-performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, industrial intelligence and other fields. It has two R&D centers in China and South Korea, six production bases for integrated circuit products in China, South Korea and Singapore. Marketing offices are distributed all over the world, which can carry out close technical cooperation with global customers and provide efficient industrial chain support.